Auto-sequencing multi-directional inline processing apparatus
An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.
1. An inline substrate processing system, comprising:
a vacuum processing chamber;
a first loadlock chamber coupled to a first side of the vacuum processing chamber;
a second loadlock chamber coupled to a second side of the vacuum processing chamber, opposite the first side;
a first exchange station coupled to the first loadlock opposite the vacuum processing chamber;
a second exchange station coupled to the second loadlock opposite the vacuum processing chamber;
a first exchange mechanism positioned in the first exchange station and operable to load fresh substrates into the first exchange station and remove processed substrates from the first exchange station;
wherein the second exchange station comprises a substrate flipping mechanism;
wherein the substrate flipping mechanism comprises:
a frame;
a plurality of pivots rotatably coupled to the frame;
a plurality of substrate holders, at least one of the substrate holders coupled to each of the pivot;
a rotating driver coupled to the pivots and rotating the pivots synchronously; and,
wherein each of the first and second loadlock chambers comprises:
an upper hanger structured to support at least one substrate;
a lower hanger structured to support at least one substrate; and,
a transport mechanism structured to move the upper and lower hangers into and out of the vacuum processing chamber.
2. The system of claim 1 , further comprising a second exchange mechanism positioned in the second exchange station and operable to load fresh substrates into the second exchange station and remove processed substrates from the second exchange station.
3. The system of claim 1 , wherein each of the pivots comprises a vacuum conduit.
4. The system of claim 1 , further comprising:
a susceptor positioned within the vacuum processing chamber; and,
an exchanger structured to exchange substrates between the upper hanger and the susceptor and between the lower hanger and the susceptor.
5. The system of claim 4 , further comprising a lift mechanism structured to move the susceptor in a vertical motion and position the susceptor in one of at least three positions:
a lower position for hanger transfer, an intermediate position for substrates exchange, and
an upper position for substrate processing.
6. The system of claim 5 , wherein the lower hanger further comprises hooks for engaging the susceptor and transporting the susceptor to one of the first or second exchange stations.
7. The system of claim 6 , wherein the processing chamber comprises a heater and the susceptor is freely positioned on top of the heater.
8. The system of claim 7 , further comprising an alignment pin positioned to align the susceptor to the heater.
9. The system of claim 8 , wherein one of the upper hanger or lower hanger comprises a floating plate and wherein the lift mechanism is structured to engage and lift the floating plate to thereby align the floating plate to the susceptor.
10. The system of claim 4 , wherein the susceptor comprises a plurality of substrate seats, each of the substrate seats having a lift pad positioned therein.
11. The system of claim 10 , wherein the vacuum processing chamber further comprises a lift pin mechanism having a plurality of lift pins, each lift pin structured to engage one of the lift pads.
12. The system of claim 1 , wherein one of the upper hanger or lower hanger is structured to exclusively introduce fresh substrates into the vacuum processing chamber, while the other one of the upper hanger or lower hanger is structured to exclusively remove processed substrates from the vacuum processing chamber.
13. The system of claim 1 , wherein each of the first and second loadlock chambers comprises active drivers and wherein each of the upper and lower hangers comprise drive extensions, such that each of the upper and lower hangers can be driven into the vacuum processing chamber by the active drivers engaging the drive extensions.
14. The system of claim 13 , further comprising a controller programmed to energize the active drivers to introduce both of the upper and lower hangers from one of the first or second loadlock chambers into the vacuum processing chamber for substrate exchange, and to remove the upper and lower hangers out of the vacuum processing chamber prior to processing the substrates inside the vacuum processing chamber.
15. The system of claim 13 , wherein the controller is programmed to await a ready signal indicating whether the first or the second loadlock chamber is ready, and to energize the active drivers corresponding to the ready signal.
16. The system of claim 1 , further comprising a sensor array positioned to detect presence/absence of substrates on at least one of the upper and lower hangers.
17. The system of claim 16 , wherein at least one of the upper hanger or lower hanger comprises trigger mechanism for activating the sensor array.
18. The system of claim 1 , further comprising:
a vacuum door positioned between the first loadlock chamber and the vacuum processing chamber; and,
at least one camera positioned outside the processing chamber and having a field of view inside the chamber via the vacuum door.
19. The system of claim 1 , further comprising:
at least one camera positioned outside the processing chamber and having a field of view inside the chamber via a window;
a processor receiving the images from the camera and inspecting the image to determine whether any broken wafer appears in the image.