IP Library Granted Patent US 8,843,731
Granted Patent B2
US 8,843,731 · App. 12/982,847 · Granted Sep 23, 2014

Memory device using extended interface commands

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Quick Facts
Patent No.
US 8,843,731
App. No.
12/982,847
Granted
Sep 23, 2014
Kind
B2
Abstract

A memory device includes a serial interface buffer that receives a hardware-decodable command and an extended interface command. The memory device also includes a logic module that directs the hardware-decodable command to a register for execution by a microcontroller. The logic module additionally loads a command received following the extended interface command into a sub-op-code register, wherein the logic module remains passive after loading the command received following the extended interface command into the sub-op-code register. Also included is a microcontroller that interprets the command in the sub-op-code register.

Claims (32)

1. A memory device comprising:

a memory array;

a serial interface buffer configured to receive a hardware-decodable command and an extended interface command;

a logic module coupled to the serial interface buffer and configured to direct the hardware-decodable command to a register for execution by a microcontroller, the logic module further configured to load a command received following the extended interface command into a. sub-op-code register, wherein the logic module remains passive after loading the command received following, the extended interface command into the sub-op-code register; and

a microcontroller configured to interpret the command in the sub-op-code register to perform operations on the memory array.

2. The memory device of claim 1 , further comprising a customization module configured to make available, by way of a branch condition, at least one previously-unused, segment of firmware for execution by the microcontroller.

3. The memory device of claim 2 , wherein the branch condition is implemented by way of a fusible link and wherein the firmware is implemented using phase change memory.

4. The memory device of claim 2 , wherein the branch condition is implemented by way of instructions stored in a FLASH memory and wherein the firmware is implemented using FLASH memory.

5. The memory device of claim 1 , wherein the extended interface command and the command following the extended interface command are received during consecutive write cycles.

6. The memory device of claim 1 , wherein the microcontroller is further configured to interface with at least one of the group consisting of NAND FLASH and phase change memory.

7. The memory device of claim 1 , further comprising a first register stack configured to load the first extended interface command along with at least one parameter associated with the first extended interface command and a second register stack configured to load a second extended interface command and at least one parameter associated with the second extended interface command.

8. The memory device of claim 1 , wherein the microcontroller is further configured to interpret the command in the sub-op-code register to determine firmware instructions to be executed.

9. A method comprising:

receiving, a command by way of a serial memory interface;

recognizing the received command is an extended interface command as opposed to a hardware-decodable command;

loading a sub-op-code that follows the extended interface command into a sub-op-code register;

interpreting, by way of a microcontroller, the contents of the sub-op-code register including maintaining a hardware decoder in a passive state in response to receiving the extended interface command and the sub-op-code; and

performing an operation in a memory array in response to the sub-op-code.

10. The method of claim 9 , wherein the interpreting includes accessing a firmware memory to obtain at least one instruction that pertains to the sub-op-code.

11. The method of claim 9 , wherein the extended interface command is received during a first write cycle and wherein the sub-op-code is received during a second write cycle that immediately follows the first write cycle.

12. The method of claim 9 , further comprising: enabling previously-unused firmware to be executed by the microcontroller.

13. The method of claim 12 , wherein the enabling is performed during a firmware upgrade.

14. The method of claim 13 , wherein the enabling includes activating a fusible link.

15. An apparatus comprising:

a logic module configured to receive a hardware-decodable command and an extended interface command by way a serial interface buffer, wherein the logic module is further configured to direct the hardware-decodable command to a register fur execution by a microcontroller, and wherein the logic module is further configured to load a command following the extended interface command into a sub-op-code register; and

at least one fusible link configured to enable a microcontroller to access instructions for interpreting the command following the extended interface command responsive to being activated.

16. The apparatus of claim 15 , wherein the at least one fusible link is configured to enable access to a register coupled to the microcontroller.

17. The apparatus of claim 15 , wherein instructions that decode the hardware-decodable commands are stored in a first memory module;

wherein instructions for interpreting the command following the extended interface command are stored in a second memory module; and

wherein the at least one fusible link is configured to function as a branch condition that causes a program branch that allows the microcontroller to access memory locations of the second memory module.

18. The apparatus of claim 15 , wherein the microcontroller is configured to interface with at least one of the group consisting of NAND FLASH and phase change memory.

19. The apparatus of claim 15 , further comprising selection logic configured to determine if additional fusible links, other than the at least one fusible link, should be activated in response to receiving an additional extended interface command and a sub-op-code that follows the additional extended interface command.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027126/0176 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2010
From: BUEB, CHRISTOPHER; KALE, POORNA; LEGLER, TODD
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025567/0087 →