IP Library Granted Patent US 8,532,583
Granted Patent B2
US 8,532,583 · App. 13/003,951 · Granted Sep 10, 2013

Semiconductor device, wireless communication device and method for generating a synthesized frequency signal

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Quick Facts
Patent No.
US 8,532,583
App. No.
13/003,951
Granted
Sep 10, 2013
Kind
B2
Abstract

A semiconductor device comprises synthesized frequency generation logic arranged to receive a reference signal, and to generate a synthesized frequency signal from the reference signal. The synthesized frequency generation logic comprises programmable divider logic arranged to receive the reference signal and to generate a divided signal comprising a frequency with a period substantially equal to N times that of the reference signal, where N comprises a programmable integer value. The synthesizer frequency generation logic is arranged to generate the synthesized frequency signal comprising a frequency with a period substantially equal to 1/M that of the divided signal, where M comprises a further programmable integer value.

Claims (44)

1. A semiconductor device comprising first synthesized frequency generation logic arranged to receive a reference signal, and to generate a first synthesized frequency signal from the reference signal;

wherein the first synthesized frequency generation logic comprises first programmable divider logic arranged to receive the reference signal and to generate a first divided signal comprising a frequency with a period equal to N times that of the reference signal, where N comprises a first programmable integer value; and

the first synthesized frequency generation logic is further arranged to generate the first synthesized frequency signal comprising a frequency with a period equal to 1/M that of the first divided signal, where M comprises a further programmable integer value.

2. The semiconductor device of claim 1 wherein the semiconductor device further comprises programmable oscillator control logic, operably coupled to an oscillator arranged to generate the reference signal, the programmable oscillator control logic being arranged to programmably control a frequency of the reference signal generated by the oscillator.

3. The semiconductor device of claim 2 wherein the programmable oscillator control logic comprises a Phased-Locked Loop (PLL), programmable by way of a tuning control.

4. The semiconductor device of claim 3 wherein the programmable oscillator control logic comprises a fractional ‘N’ divider and the programmable oscillator control logic is programmable by controlling a divide ratio used by the fractional ‘N’ divider.

5. The semiconductor device of claim 2 wherein the programmable oscillator control logic is programmable by way of an Absolute Radio Frequency Channel Number (ARFCN) input signal.

6. The semiconductor device of claim 2 wherein the programmable oscillator control logic is arranged to programmably control a frequency of the reference signal generated by the oscillator over approximately a 4% range thereof.

7. The semiconductor device of claim 1 wherein the first synthesizer frequency generation logic comprises a Delay-Locked Loop (DLL).

8. The semiconductor device of claim 1 wherein the first synthesizer frequency generation logic comprises:

delay elements, the delay elements arranged to receive the first divided signal generated by the programmable divider logic; and

logic to generate at least M component signals comprising corresponding edge transitions separated in time by T/M, where T is a period of the divided signal (f div ).

9. The semiconductor device of claim 8 wherein the first synthesizer frequency generation logic further comprises digital processing logic arranged to receive the at least M component signals, and logic to generate the synthesized frequency signal based at least partly on a combination of the component signals provided thereto by selecting those component signals to output.

10. The semiconductor device of claim 1 wherein the semiconductor device comprises radio frequency, RF, transceiver circuitry arranged to support RF communication within a Universal Mobile Telecommunications System, UMTS.

11. The semiconductor device of any claim 1 wherein the synthesized frequency generation logic module generates a first synthesized frequency signal from the reference signal, and a second synthesized frequency logic is arranged to receive the reference signal and to generate a second synthesized frequency signal from the reference signal; and the programmable divider logic generates a first divided signal comprising a frequency with a period equal to N rx times that of the reference signal, and the synthesized frequency signal comprises a frequency with a period equal to 1/M rx that of the divided signal; and

the second synthesized frequency logic comprises second programmable divider logic arranged to receive the reference signal and to generate a second divided signal comprising a frequency with a period equal to N tx times that of the reference signal, such that the second synthesized frequency generation logic is further arranged to generate the second synthesized frequency signal comprising a frequency with a period equal to 1/M tx that of the second divided signal;

where N rx , N tx , M rx and M tx each comprise a programmable integer value.

12. The semiconductor device of claim 11 wherein the first synthesized frequency signal is used for down converting a received Radio Frequency, RF, signal to a receive chain intermediate frequency signal, and the second synthesized frequency signal is used for up converting a transmit chain intermediate frequency signal to an RF signal to be transmitted.

13. The semiconductor device of claim 12 wherein the semiconductor device further comprises frequency error correction logic arranged to introduce a frequency error correction offset into at least one from a group of:

the receive chain intermediate frequency signal; and

the transmit chain intermediate frequency signal.

14. The semiconductor device of claim 13 wherein frequency error correction is performed within a digital domain.

15. A method for generating a synthesized frequency signal, the method comprising:

configuring an oscillator to generate a reference signal;

generating a first divided signal comprising a frequency with a period equal to N times that of the reference signal; and

generating a first synthesized frequency signal comprising a frequency having a period equal to 1/M that of the first divided signal, where M comprises a further programmable integer value.

16. The method of claim 15 wherein:

the first divided signal comprises a frequency having a period equal to N rx times that of the reference signal and the first synthesized frequency signal comprises a frequency with a period equal to 1/M rx that of the first divided signal; wherein

the method further comprises:

generating a second divided signal comprising a frequency with a period equal to N tx times that of the reference signal, and

generating a second synthesized frequency signal comprising a frequency with a period equal to 1/M tx that of the second divided signal;

where N rx , N tx , M rx and M tx each comprise a programmable integer value.

17. A semiconductor device comprising:

a phase locked loop (PLL) arranged to programmably control a VCO to provide a reference signal;

a first frequency generator comprising a first programmable divider arranged to receive the reference signal and to generate a first divided signal with a period equal to N rx times that of the reference signal, wherein the first frequency generator is arranged to generate a first frequency signal with a period equal to 1/M rx that of the first divided signal; and

a second frequency generator comprising a second programmable divider arranged to receive the reference signal and to generate a second divided signal with a period equal to N tx times that of the reference signal, wherein the second frequency generator is arranged to generate a second frequency signal with a period equal to 1/M tx that of the second divided signal;

wherein N rx , M rx , N tx , and M tx , each comprise a programmable integer value.

18. The semiconductor device of claim 17 , wherein the PLL is further arranged to control a frequency of the reference signal generated by the VCO.

19. The wireless communication device of claim 17 , wherein the first frequency generator further comprises:

delay elements arranged to receive the first divided signal; and

logic to generate at least M rx component signals comprising corresponding edge transitions separated in time by T/M rx , where T is a period of the divided signal.

20. The semiconductor device of claim 19 , wherein the first frequency generator further comprises:

digital processing logic arranged to receive the at least M rx component signals; and

a signal combiner arranged to generate the first frequency signal based on a combination of the component signals by selecting the combination of component signals to output.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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SECURITY AGREEMENT Recorded Nov 6, 2013
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SECURITY AGREEMENT Recorded Jan 31, 2012
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To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
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To: CITIBANK, N.A., AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2011
From: BEAMISH, NORMAN; KEARNEY, NIALL
To: FREESCALE SEMICONDUCTOR INC.
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