IP Library Granted Patent US 8,339,860
Granted Patent B2
US 8,339,860 · App. 13/011,629 · Granted Dec 25, 2012

Semiconductor memory device

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Quick Facts
Patent No.
US 8,339,860
App. No.
13/011,629
Granted
Dec 25, 2012
Kind
B2
Abstract

This invention offers a semiconductor memory device, with which a resolution to read-out data is not reduced even at the time of verify and a stable read-out operation is possible even when a power supply voltage is reduced. A read-out circuit is provided with a current-voltage conversion circuit, that converts a cell current into a data voltage, and a sense amplifier that compares the data voltage with a reference voltage. The current-voltage conversion circuit is formed to include a variable load resistor that is connected to the memory cell through a bit line. The variable load resistor is formed to include P channel type MOS transistors that make load resistors and P channel type MOS transistors that constitute a switching circuit.

Claims (23)

1. A semiconductor memory device comprising:

a bit line;

a memory cell connected to the bit line, the memory cell being configured so that data is electrically written-into and read-out from the memory cell and providing the bit line with a cell current corresponding to the data;

a current-voltage conversion circuit converting the cell current flowing through the bit line into a data voltage and comprising a variable load resistor connected to the memory cell through the bit line; and

a sense amplifier comparing the data voltage with a reference voltage,

wherein the variable load resistor comprises a plurality of MOS transistors and a switching circuit that selectively connects at least one of the MOS transistors to the memory cell.

2. The semiconductor memory device of claim 1 , wherein the switching circuit comprises a first switching device connected between the bit line and a drain of one of the MOS transistors.

3. The semiconductor memory device of claim 2 , wherein the switching circuit further comprises a second switching device connected between the bit line and a gate of the one of the MOS transistors.

4. The semiconductor memory device of claim 1 ,

wherein the reference voltage is set at the center or around the center of an input operating voltage range of the sense amplifier.

5. A semiconductor memory device comprising:

a bit line;

a memory cell connected to the bit line, the memory cell being configured so that data is electrically written-into and read-out from the memory cell and providing the bit line with a cell current corresponding to the data;

a current-voltage conversion circuit converting the cell current flowing through the bit line into a data voltage and comprising a variable load resistor connected to the memory cell through the bit line; and

a sense amplifier comparing the data voltage with a reference voltage,

wherein the variable load resistor comprises a plurality of resistors and a switching circuit that selectively connects at least one of the resistors to the memory cell.

6. The semiconductor memory device of claim 5 , wherein the switching circuit comprises an analog switch connected in series to one of the resistors.

7. A semiconductor memory device comprising:

a bit line;

a memory cell connected to the bit line, the memory cell being configured so that data is electrically written-into and read-out from the memory cell and providing the bit line with a cell current corresponding to the data;

a current-voltage conversion circuit converting the cell current flowing through the bit line into a data voltage and comprising a variable load resistor connected to the memory cell through the bit line; and

a sense amplifier comparing the data voltage with a reference voltage,

wherein a resistance of the variable load resistor is configured to be a first resistance at a time of normal read-out and to be a second resistance at a time of verify read-out, the second resistance being different from the first resistance, the verify read-out judging whether the data is written in the memory cell correctly.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2016
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038994/0667 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2016
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038988/0600 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CHANGE OF NAME Recorded Feb 19, 2016
From: SANYO SEMICONDUCTOR CO., LTD.
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 037773/0090 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2011
From: MARUYAMA, JUMPEI; YOSHIKAWA, SADAO
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 025701/0909 →