Semiconductor package with heat dissipation devices
View Patent ↗A semiconductor package includes a first semiconductor chip having a first surface and a second surface which faces away from the first surface, a heat dissipation member, defined with a cavity, disposed on the first surface of the first semiconductor chip and having a plurality of metal pillars which contact the first semiconductor chip, and one or more second semiconductor chips stacked on the first surface of the first semiconductor chip in the cavity to be electrically connected with one another and with the first semiconductor chip.
1. A semiconductor package comprising:
a first semiconductor chip having a first surface and a second surface which faces away from the first surface;
a heat dissipation member, defined with a cavity, disposed on the first surface of the first semiconductor chip and having a plurality of metal pillars which contact the first semiconductor chip; and
one or more second semiconductor chips stacked on the first surface of the first semiconductor chip in the cavity electrically connected with one another and with the first semiconductor chip.
2. The semiconductor package according to claim 1 , wherein the first semiconductor chip is one of: a logic chip and a memory chip.
3. The semiconductor package according to claim 1 , wherein the heat dissipation member is formed of a ceramic material.
4. The semiconductor package according to claim 1 , wherein the metal pillars are formed of any one of: copper (Cu), gold (Au), aluminum (Al), and silver (Ag), or an alloy including at least one thereof.
5. The semiconductor package according to claim 1 , wherein at least one of the plurality of metal pillars is bent toward a side surface of the heat dissipation member.
6. The semiconductor package according to claim 5 , further comprising:
a metal layer pattern formed on the side surface of the heat dissipation member to contact the bent metal pillar.
7. The semiconductor package according to claim 1 , further comprising:
metal line patterns installed in the heat dissipation member and extending among the plurality of metal pillars in a direction perpendicular to the metal pillars.
8. The semiconductor package according to claim 7 , further comprising:
a metal layer pattern formed on the side surface of the heat dissipation member in such a way as to contact the metal line patterns.
9. The semiconductor package according to claim 1 , further comprising:
a metal layer pattern formed on an upper surface of the heat dissipation member in such a way as to contact the metal pillars.
10. The semiconductor package according to claim 1 , further comprising:
a plurality of additional metal pillars installed in the heat dissipation member over the cavity.
11. The semiconductor package according to claim 10 , further comprising:
a metal layer pattern formed on the upper surface of the heat dissipation member in such a way as to contact the additional metal pillars.
12. The semiconductor package according to claim 10 , further comprising:
a metal layer pattern formed in the heat dissipation member over the cavity in such a way as to contact the additional metal pillars.
13. The semiconductor package according to claim 1 , further comprising:
a metal layer pattern formed over the first semiconductor chip in such a way as to contact the metal pillars.
14. The semiconductor package according to claim 1 , further comprising:
a TIM (thermal interface material) formed on a surface portion of the heat dissipation member over the cavity.
15. The semiconductor package according to claim 1 , further comprising:
a TIM formed on at least a portion of the first surface of the first semiconductor chip.
16. The semiconductor package according to claim 1 , further comprising:
a substrate having an upper surface and a lower surface, the first semiconductor chip including the heat dissipation member and the second semiconductor chips being mounted to the upper surface of the substrate; and
external mounting members attached to the lower surface of the substrate.
17. The semiconductor package according to claim 16 , further comprising:
an encapsulation member sealing the upper surface of the substrate including the heat dissipation member and the first semiconductor chip.
18. The semiconductor package according to claim 16 , further comprising:
connection members interposed between the upper surface of the substrate and the first semiconductor chip.
19. The semiconductor package according to claim 1 , further comprising:
pads disposed on the second surface of the first semiconductor chip;
redistribution lines formed to be connected with the pads; and
external connection terminals attached to the redistribution lines.
20. The semiconductor package according to claim 19 , further comprising:
an insulation layer formed on the second surface of the first semiconductor chip in such a way as to expose at least portions of the redistribution lines.