IP Library Granted Patent US 8,379,464
Granted Patent B2
US 8,379,464 · App. 13/024,979 · Granted Feb 19, 2013

Semiconductor integrated circuit device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,379,464
App. No.
13/024,979
Granted
Feb 19, 2013
Kind
B2
Abstract

A semiconductor device includes a booster circuit and a detector. The booster circuit is configured to boost an input voltage and output an output voltage, and the detector is configured to output the output voltage, which is output from the booster circuit, and control the booster circuit to generate a plurality of different voltages in accordance with an operating mode.

Claims (29)

1. A semiconductor device comprising:

a booster circuit configured to boost an input voltage and output an output voltage; and

a detector configured to output the output voltage, which is output from the booster circuit, and control the booster circuit to generate a plurality of different voltages in accordance with an operating mode.

2. The semiconductor device as claimed in claim 1 , wherein

the detector includes a comparator configured to compare a set voltage, which is generated from the output voltage and is prescribed in accordance with the operating mode with a reference potential, and use an output signal of the comparator to control the booster circuit.

3. The semiconductor device as claimed in claim 2 , wherein

the detector includes a set voltage generator configured to divide the output voltage by resistance division and generate different set voltages prescribed in accordance with the operating mode, the set voltage generator changing a ratio of the resistance division in accordance with the operating mode to generate the different set voltages.

4. The semiconductor device as claimed in claim 3 , wherein

the booster circuit selectively outputs a first booster voltage of a first potential and a second booster voltage of a second potential lower than the first potential in accordance with the different set voltages.

5. The semiconductor device as claimed in claim 4 , the semiconductor device further comprising:

a discharge controller configured to be connected to an internal power source line to which an output voltage of the booster circuit is supplied and make the internal power source line to discharge when the output voltage of the booster circuit switches from the first booster voltage to the second booster voltage.

6. The semiconductor device as claimed in claim 5 , wherein

the discharge controller includes:

a discharge control circuit configured to generate a one-shot pulse signal from a timing when the first booster voltage switches to the second booster voltage; and

a discharger configured to receive the one-shot pulse signal and connect the internal power source line to the ground for discharge.

7. The semiconductor device as claimed in claim 4 , the semiconductor device further comprising:

a memory configured to write and read data by using an output voltage of the booster circuit.

8. The semiconductor device as claimed in claim 7 , wherein

the memory is a flash memory;

the operating modes include a data write mode and a data read mode; and

in the data write mode, the first booster voltage is supplied to a gate of a memory cell in the flash memory, and

in the data read mode, the second booster voltage is supplied to a drain of the memory cell.

9. The semiconductor device as claimed in claim 8 , wherein

the flash memory includes:

a memory cell array where a plurality of memory cells are arranged in a matrix;

an X-decoder configured to be connected to gates of the memory cells arranged in a row direction through a plurality of word lines; and

a Y-decoder configured to be connected to drains of the memory cells arranged in a column direction through a plurality of bit lines, wherein

the first booster voltage is supplied through a first switch circuit to the X-decoder, and

the second booster voltage is supplied through a second switch circuit to the Y-decoder.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: CYPRESS SEMICONDUCTOR CORPORATION
To: LONGITUDE FLASH MEMORY SOLUTIONS LTD.
Reel/Frame 058346/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2021
From: CYPRESS SEMICONDUCTOR CORPORATION
To: LONGITUDE FLASH MEMORY SOLUTIONS LTD.
Reel/Frame 058340/0069 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2021
From: MUFG UNION BANK, N.A.,
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 057501/0144 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036051/0786 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2011
From: NAKAKUBO, ATSUSHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025798/0634 →