Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
View Patent ↗A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.
1. A structure comprising:
a wiring interconnect structure having an interface comprising a metal wiring layer and a capping layer of a first material type; and
an electronic fuse interconnect structure having an interface comprising a metal wiring layer and a capping layer of a second material type,
wherein the interface of the electronic fuse interconnect structure includes a metal layer and the capping layer which comprises SiN and the interface of the wiring interconnect structure includes a metal layer and the capping layer comprises one of: Co(W,P,B), Ru, Ir, Rh and Pt.
2. A structure comprising:
a wiring interconnect structure having an interface comprising a metal wiring layer and a capping layer of a first material type; and
an electronic fuse interconnect structure having an interface comprising a metal wiring layer and a capping layer of a second material type,
wherein the first material type is different than the second material type.
3. A structure comprising:
a wiring interconnect structure having an interface comprising a metal wiring layer and a capping layer of a first material type; and
an electronic fuse interconnect structure having an interface comprising a metal wiring layer and a capping layer of a second material type,
wherein the second material type and/or the metal wiring layer of the electronic fuse interconnect structure is damaged thereby exhibiting degraded interfacial properties between the metal wiring layer and the second material type.
4. The structure of claim 3 , wherein the damage is a treatment from one of radiation sources and laser light.
5. A structure comprising:
a wiring interconnect structure having an interface comprising a metal wiring layer and a capping layer of a first material type; and
an electronic fuse interconnect structure having an interface comprising a metal wiring layer and a capping layer of a second material type,
wherein the wiring interconnect structure has a greater electromigration (EM) resistance than the electronic fuse interconnect structure and the second material type in combination with a metal layer is configured to provide EM resistance.
6. A structure comprising:
a wiring interconnect structure having an interface comprising a metal wiring layer and a capping layer of a first material type;
an electronic fuse interconnect structure having an interface comprising a metal wiring layer and a capping layer of a second material type; and
a third interconnect structure having a third interfacial structure, different from a first and second interfacial structure of the electronic fuse interconnect structure and the wiring interconnect structure.