IP Library Granted Patent US 8,369,804
Granted Patent B2
US 8,369,804 · App. 13/060,549 · Granted Feb 5, 2013

Wireless communication unit, semiconductor device and power control method therefor

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Quick Facts
Patent No.
US 8,369,804
App. No.
13/060,549
Granted
Feb 5, 2013
Kind
B2
Abstract

A wireless communication unit comprises a transmitter comprising a power amplifier, an inner feedback power control loop having a power control logic module comprising loop priming logic module operably coupled to the power amplifier, and a switchable outer digital loop comprising switchable logic module. The loop priming logic module is arranged to set a power reference value for controlling the power amplifier prior to a ramping operation of the power amplifier and the switchable logic module switching the switchable outer digital loop on or off, thereby restricting adverse transient behavior of the power amplifier.

Claims (35)

1. A wireless communication unit comprising:

a power amplifier;

an inner feedback power control loop comprising a power control logic module, the power control logic module comprising a loop priming logic module operably coupled to the power amplifier; and

a switchable outer digital loop comprising a switchable logic module; wherein

the loop priming logic module is arranged to set a power reference value for controlling the power amplifier prior to a ramping operation of the power amplifier and prior to the switchable logic module switching the switchable outer digital loop on or off thereby restricting adverse transient behaviour of the power amplifier, and

a transmitter of the wireless communication unit comprises the power amplifier, inner feedback power control loop, and switchable outer digital loop.

2. The wireless communication unit according to claim 1 wherein the power control logic module arranges for the inner loop to provide an initial output power leveling of the power amplifier during a ramp up operation.

3. The wireless communication unit according to claim 2 wherein the power control logic module arranges for the outer digital loop to remain in an open-loop mode of operation during the ramp up operation.

4. The wireless communication unit according to claim 1 wherein the power control logic module is configured to determine a latency of the outer digital loop and the switchable logic module is configured to switch the switchable outer digital loop on or off in response to the determined latency.

5. The wireless communication unit according to claim 4 wherein the power control logic module is further arranged to

disable the outer digital loop; and

perform a power backoff operation if the latency of the outer digital loop exceeds a threshold.

6. The wireless communication unit according to claim 5 wherein the power control logic module is further arranged to perform a power backoff operation by setting an inner loop power reference value for the power amplifier.

7. The wireless communication unit according to claim 6 wherein the power control logic module is further arranged to determine when the inner loop has settled and in response to the determination the loop priming logic module re-primes and re-engages the outer digital loop.

8. The wireless communication unit according to claim 1 wherein the loop priming logic module is further arranged to set the power reference value with a filtered version of a fed back detected signal coupled from the power amplifier.

9. The wireless communication unit according to claim 1 wherein the loop priming logic module is further arranged to prime both the inner loop and outer digital loop when switching between a closed loop operation and an open loop operation.

10. The wireless communication unit according to claim 1 wherein the outer digital loop is used for latency detection.

11. The wireless communication unit according to claim 1 wherein the power control logic module is arranged to add low-level perturbations to an outer digital loop reference when both the inner loop and the outer digital loop are engaged to determine whether the power amplifier is in a soft saturation mode of operation.

12. The wireless communication unit according to claim 11 further comprising:

a Smith predictor loop, wherein

the power control logic module is arranged to determine a loop latency based on the Smith predictor loop response to the added low-level perturbations.

13. The wireless communication unit according to claim 12 wherein the power control logic module is arranged to determine that the power amplifier is in a soft saturation mode of operation if a peak-to-peak transient response of the low-level perturbations exceeds a threshold level.

14. A method for power control of a power amplifier comprising an inner feedback power control loop and a switchable outer digital loop, the method comprising:

engaging the inner feedback power control loop;

engaging the switchable outer digital loop; and

setting a power reference value for controlling the power amplifier prior to performing a ramping operation of the power amplifier and switching the switchable outer digital loop on or off, thereby restricting adverse transient behaviour of the power amplifier.

15. A semiconductor device for a transmitter that comprises a power amplifier, wherein the semiconductor device comprises:

an inner feedback power control loop having a power control logic module wherein the power control logic module comprises a loop priming logic module for operably coupling to the power amplifier; and

a switchable outer digital loop comprising a switchable logic module for operably coupling to the power amplifier,

wherein the loop priming logic module is arranged to set a power reference value for controlling the power amplifier prior to a ramping operation of the power amplifier and the switchable logic module switching the switchable outer digital loop on or off, thereby restricting adverse transient behaviour of the power amplifier.

16. The semiconductor device according to claim 15 wherein the power control logic module arranges for the inner loop to provide an initial output power leveling of the power amplifier during a ramp up operation.

17. The semiconductor device according to claim 16 wherein the power control logic module arranges for the outer digital loop to remain in an open-loop mode of operation during the ramp up operation.

18. The semiconductor device according to claim 15 wherein the power control logic module is configured to determine a latency of the outer digital loop and the switchable logic module is configured to switch the switchable outer digital loop on or off in response to the determined latency.

19. The semiconductor device according to claim 15 wherein the loop priming logic module is further arranged to set the power reference value with a filtered version of a fed back detected signal coupled from the power amplifier.

20. The semiconductor device according to claim 15 wherein the loop priming logic module is further arranged to prime both the inner loop and outer digital loop when switching between a closed loop operation and an open loop operation.

Assignments (25)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →