IP Library Granted Patent US 8,675,685
Granted Patent B2
US 8,675,685 · App. 13/061,626 · Granted Mar 18, 2014

Method and apparatus for transmitting data

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Quick Facts
Patent No.
US 8,675,685
App. No.
13/061,626
Granted
Mar 18, 2014
Kind
B2
Abstract

A semiconductor device comprising interface logic for transmitting data bursts across an interface. The interface logic is arranged to transmit bursts of data across the interface such that the start of a burst of data is substantially aligned with a symbol interval (SI) boundary. The interface logic is further arranged to apply an offset to the SI boundary at the start of the burst of data.

Claims (25)

1. A semiconductor device comprising:

interface logic for transmitting data bursts across an interface, the interface logic being arranged to transmit bursts of data across the interface, wherein the start of a burst of data is substantially aligned with a symbol interval (SI) boundary, and to apply an offset to the SI boundary at the start of successive bursts of data after the burst of data, wherein the offset to the SI boundary is relative to other transmitted bursts, wherein the interface logic is arranged to apply an offset of (+/−N*UI) to the SI boundary at the start of the burst of data, where unit interval (UI) equals a unit interval, and N equals (K−1), where K equals the number of unit intervals in one symbol interval.

2. The semiconductor device of claim 1 wherein the interface logic is arranged to apply a substantially random offset to the SI boundary at the start of each burst of data.

3. The semiconductor device of claim 1 wherein the interface logic is arranged to apply an offset to the SI boundary at the start of a burst of data in accordance with an offset sequence.

4. The semiconductor device of claim 1 wherein the interface logic comprises timing logic arranged to generate an SI timing signal in accordance with which the transmission of each burst of data is substantially aligned, and the timing logic is further arranged to apply an offset to the SI timing signal at the start of a burst of data.

5. The semiconductor device of claim 4 wherein the timing logic comprises divider logic arranged to receive a unit interval (UI) timing signal, the divider logic is further arranged to receive an SI value and to divide the UI timing signal by the received SI value to generate the SI timing signal.

6. The semiconductor device of claim 5 wherein the timing logic further comprises offset generation logic arranged to generate an offset value, wherein the offset value is applied to a default SI value, the resulting SI value being provided to the divider logic for generating the SI timing signal.

7. The semiconductor device of claim 6 wherein the offset generation logic is arranged to generate a substantially random offset value.

8. The semiconductor device of claim 6 wherein the offset generation logic is arranged to generate an offset value in accordance with a predetermined offset sequence.

9. The semiconductor device of claim 1 wherein the interface logic comprises dither logic arranged to receive a unit interval (UI) timing signal and to offset a transition between a sleep/stall state and a start of a burst of data by integer multiples of unit intervals.

10. The semiconductor device of claim 9 wherein the dither logic is further arranged to generate a symbol interval (SI) timing signal, substantially synchronised to the offset transition between the sleep/stall state and a start of a burst data, and to provide the SI timing signal to other components within the interface logic.

11. The semiconductor device of claim 9 wherein the dither logic is arranged to offset the transition between the sleep/stall state and a start of a burst of data by a substantially random multiple of unit intervals.

12. The semiconductor device of claim 9 wherein the dither logic is arranged to offset the transition between the sleep/stall state and a start of a burst of data in accordance with a predetermined offset sequence.

13. A semiconductor device comprising:

interface logic for transmitting data bursts across an interface, the interface logic being arranged to transmit bursts of data across the interface wherein the start of a burst of data is substantially aligned with a symbol interval (SI) boundary, and to apply an offset to the SI boundary at the start of successive bursts of data after the burst of data, wherein the offset to the SI boundary is relative to other transmitted bursts wherein the interface logic is arranged to a offset of (+/−N*UI) to the SI boundary at the start of the burst of data, where unit interval (UI) equals a unit interval, and N equals (K−1), where K equals the number of unit intervals in one symbol interval, and wherein the interface logic is arranged to encode data to be transmitted across the interface using 8b/10b encoding, and a symbol interval (SI) is substantially equal to ten unit intervals (UIs).

14. The semiconductor device of claim 1 wherein the interface comprises a MIPI DigRF interface.

15. The semiconductor device of claim 14 wherein the semiconductor device comprises one of a baseband integrated circuit (BBIC) or an RF (Radio Frequency) integrated circuit (RFIC).

16. A wireless communication device comprising a semiconductor device adapted according to claim 1 .

17. A method for transmitting data across an interface, the method comprising:

transmitting bursts of data across the interface, wherein the start of a burst of data is substantially aligned with a symbol interval boundary;

applying an offset to the SI boundary at the start of successive bursts of data after the burst of data, wherein the offset to the SI boundary is relative to other transmitted bursts; and

applying an offset of (+/−N*UI) to the SI boundary at the start of the burst of data, where unit interval (UI) equals a unit interval, and N equals (K−1), where K equals the number of unit intervals in one symbol interval.

18. The semiconductor device of claim 1 wherein the interface logic includes:

a data storage to store data received at the interface logic; and

a line driver coupled to the data storage and to the interface, the line driver to transmit the data stored in the data storage in the data bursts across the interface.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2011
From: KELLEHER, PAUL; O'BRIEN, MICHAEL; O'KEEFFE, CONOR
To: FREESCALE SEMICONDUCTOR INC
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