IP Library Granted Patent US 8,274,049
Granted Patent B2
US 8,274,049 · App. 13/065,238 · Granted Sep 25, 2012

Sample processing and observing method

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Quick Facts
Patent No.
US 8,274,049
App. No.
13/065,238
Granted
Sep 25, 2012
Kind
B2
Abstract

There is provided a sample processing and observing method including irradiating a focused ion beam to a sample to form an observed surface, irradiating an electron beam to the observed surface to form an observed image, removing the surface opposite to the observed surface of the sample, forming a lamella including the observed surface and obtaining a transmission observed image for the lamella.

Claims (20)

1. A sample processing and observing method comprising:

an observed surface forming step of irradiating a focused ion beam to the sample in a direction substantially parallel to an observed surface so as to remove a surface of the sample and exposing the observed surface;

an observed image obtaining step of irradiating a charged particle beam to the observed surface in a direction substantially perpendicular to the observed surface, detecting generated secondary charged particles, and forming an observed image;

a lamella forming step of irradiating the focused ion beam to the sample in a direction substantially parallel to the observed surface, removing a surface opposite to the observed surface of the sample, and forming a lamella including the observed surface; and

a transmission observed image obtaining step of irradiating the charged particle beam to the lamella in the direction substantially perpendicular to the observed surface, detecting transmitted charged particles which are transmitted through the lamella, and forming a transmission observed image.

2. The sample processing and observing method according to claim 1 , wherein in the transmission observed image obtaining step, the sample is fixed to a position of the sample at which the observed image is obtained, and the charged particle beam is irradiated to the observed surface in the direction substantially perpendicular to the observed surface.

3. The sample processing and observing method according to claim 1 , wherein the observed image obtaining step includes:

a surface removing step of irradiating the focused ion beam so as to form a cross-section by removing a surface of the sample;

a cross-section observed image obtaining step of obtaining a cross-section observed image by irradiating the charged particle beam to the cross-section formed using the focused ion beam; and

a cross-section forming step of forming a next cross-section by irradiating the focused ion beam to the cross-section so as to remove the cross-section,

wherein the cross-section observed image obtaining step and the cross-section forming step are repeatedly performed until the observed surface is exposed.

4. The sample processing and observing method according to claim 1 , further comprising:

a lamella observed surface removing step of irradiating the focused ion beam such that the observed surface of the lamella for which the transmission observed image is obtained is removed and a cross-section is formed;

a lamella cross-section observed image obtaining step of obtaining a cross-section observed image by irradiating the charged particle beam to the cross-section formed using the focused ion beam;

a lamella cross-section forming step of forming a next cross-section by irradiating the focused ion beam to the cross-section so as to remove the cross-section; and

obtaining a plurality of lamella cross-section images by repeatedly performing the lamella cross-section forming step and the lamella cross-section observed image obtaining step.

5. The sample processing and observing method according to claim 4 , wherein a three-dimensional image for the lamella is built based on the lamella cross-section images and information regarding a distance between the cross-sections.

6. The sample processing and observing method according to claim 1 , wherein

the charged particle beam is an electron beam or a gas ion beam.

7. The sample processing and observing method according to claim 6 , wherein the gas ion beam is a gas ion beam emitted from a gas field ion source.

Assignments (4)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0636 →
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072909/0223 →
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2011
From: TANAKA, KEIICHI; YAMAMOTO, YO; MAN, XIN; TASHIRO, JUNICHI; FUJII, TOSHIAKI
To: SII NANOTECHNOLOGY INC.
Reel/Frame 026305/0580 →