IP Library Granted Patent US 8,708,556
Granted Patent B2
US 8,708,556 · App. 13/065,687 · Granted Apr 29, 2014

Thermal analyzer

Inventors: Kentaro Yamada (Chiba, JP); Shinya Nishimura (Chiba, JP); Hirohito Fujiwara (Chiba, JP)
Assignee: SII NanoTechnology
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Quick Facts
Patent No.
US 8,708,556
App. No.
13/065,687
Granted
Apr 29, 2014
Kind
B2
Abstract

A thermal analyzer heats and cools a sample placed inside a furnace for measuring a thermal characteristic of the sample during heating and cooling. The thermal analyzer has a multilayer structure for covering the furnace and its surroundings so as to isolate the furnace and its surroundings from an external environment. The multilayer structure includes a multilayer wall with two layers formed of a material having high thermal conductivity and heat dissipation property. The two layers are spaced apart from one another to provide therebetween an interlayer that contains a substance having a heat capacity substantially equal to a gas contained in the furnace so that heat transfer between the two layers is minimized.

Claims (24)

1. A thermal analyzer that heats and cools a sample placed inside a furnace for measuring a thermal characteristic of the sample during heating and cooling, the thermal analyzer comprising: a multilayer structure for covering the furnace and its surroundings so as to isolate the furnace and its surroundings from an external environment, the multilayer structure including a multilayer wall comprised of two layers formed of a material having high thermal conductivity and heat dissipation property, the two layers being spaced apart from, and not in direct contact with, one another to provide therebetween an interlayer space that contains a substance having a heat capacity substantially equal to a gas contained in the furnace so that heat transfer between the two layers is minimized; and a cooling block configured to be connected to a cooling device for cooling the furnace, the cooling block being arranged below the furnace through intermediation of a heat resistant material and having a heat insulation material covering the cooling block and its surrounding so as to insulate the cooling block from heat of the external environment.

2. A thermal analyzer according to claim 1 , wherein the two layers are spaced-apart from one another at a distance ranging from 0.5 mm to 50 mm.

3. A thermal analyzer according to claim 1 , wherein the thermal analyzer comprises a differential scanning calorimeter.

4. A thermal analyzer according to claim 1 , wherein the substance that is contained in the interlayer comprises a gas.

5. A thermal analyzer according to claim 4 , wherein the two layers are spaced-apart from one another at a distance ranging from 0.5 mm to 50 mm.

6. A thermal analyzer according to claim 1 , wherein each of the two layers of the multilayer wall comprises a metal wall member.

7. A thermal analyzer according to claim 6 , wherein a thickness of each of the metal wall members ranges from 0.1 mm to 3 mm.

8. A thermal analyzer according to claim 1 , wherein the multilayer structure further includes a multilayer lid including two layer lids mounted to respective ones of the two layers of the multilayer wall.

9. A thermal analyzer according to claim 8 , wherein the multilayer wall further comprises another layer formed of a material having heat and corrosion resistance; and wherein the multilayer lid further includes another layer lid mounted on the another layer.

10. A thermal analyzer according to claim 1 , wherein the multilayer wall further comprises another layer formed of a material having heat and corrosion resistance.

11. A thermal analyzer according to claim 10 , wherein the another layer is spaced apart from the furnace at a distance of 1 mm.

12. A thermal analyzer according to claim 10 , wherein each of the two layers is formed of aluminum and the another layer is formed of stainless steel.

13. A thermal analyzer according to claim 10 , wherein each of the two layers and the another layer has a thickness in the range of from 0.1 mm to 3 mm.

14. A thermal analyzer according to claim 10 , wherein each of the two layers and the another layer has a thickness in the range of from 0.3 mm to 2 mm.

15. A thermal analyzer comprising:

a furnace configured to receive therein a sample that is to be heated and cooled for measuring a thermal characteristic of the sample;

a heat insulation structure covering the furnace so as to isolate the furnace from variations in temperature external to the thermal analyzer, the heat insulation structure having a multilayer wall formed of a plurality of wall layers including two wall layers spaced apart from, and not in direct contact with, one another to form a space between the two wall layers, and a gas layer formed in the space between the two wall layers and having a heat capacity substantially equal to a gas contained in the furnace so that heat transfer between the two wall layers is minimized;

a cooling block configured to be connected to a cooling device for cooling the furnace, the cooling block being arranged below the furnace through intermediation of a heat resistant material; and

a heat insulation material covering the cooling block and its surrounding so as to insulate the cooling block from heat of the external environment.

16. A thermal analyzer according to claim 15 , wherein the two wall layers are spaced-apart from one another at a distance ranging from 0.5 mm to 50 mm.

17. A thermal analyzer according to claim 15 , wherein the gas layer is formed of air.

18. A thermal analyzer according to claim 15 , wherein each of the two wall layers and the another wall layer has a thickness in the range of from 0.1 mm to 3 mm.

19. A thermal analyzer according to claim 15 , wherein the plurality of wall layers further includes another wall layer spaced apart from the furnace at a distance closer than that of the two wall layers.

20. A thermal analyzer according to claim 19 , wherein each of the two wall layers is formed of aluminum and the another wall layer is formed of stainless steel.

Assignments (4)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0636 →
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072909/0223 →
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2011
From: YAMADA, KENTARO; NISHIMURA, SHINYA; FUJIWARA, HIROHITO
To: SII NANO TECHNOLOGY INC.
Reel/Frame 026450/0771 →
Priority Claims (2)
JP 2010-076380 · Mar 29, 2010 · national
JP 2010-261720 · Nov 24, 2010 · national
Continuity (1)
Related Publication 20110235671A1 · Sep 29, 2011