IP Library Granted Patent US 8,274,832
Granted Patent B2
US 8,274,832 · App. 13/089,259 · Granted Sep 25, 2012

Dynamic polarization for reducing stress induced leakage current

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Quick Facts
Patent No.
US 8,274,832
App. No.
13/089,259
Granted
Sep 25, 2012
Kind
B2
Abstract

Subject matter disclosed herein relates to non-volatile flash memory, and more particularly to a method of reducing stress induced leakage current.

Claims (33)

1. A method comprising:

operating a non-volatile memory device in a standby mode; and

applying a voltage wave-form to a memory cell of said non-volatile memory device to generate an electric field between a floating gate of said memory cell and a substrate of said non-volatile memory device while storing a “0” state in said memory cell and while said non-volatile memory device is operating in said standby mode, wherein said “0” state corresponds to said floating gate being negatively charged.

2. The method of claim 1 , wherein said non-volatile memory device comprises a flash memory device.

3. The method of claim 1 , wherein said voltage wave-form is applied via a body of said memory cell.

4. The method of claim 1 , wherein said applying said voltage wave-form comprises applying a square wave voltage to said memory cell, wherein said square wave voltage includes a positive voltage portion and a negative voltage portion.

5. The method of claim 1 , further comprising sequentially applying said voltage wave-form to individual word-lines of said non-volatile memory device.

6. The method of claim 1 , further comprising sequentially applying said voltage wave-form to individual blocks of said non-volatile memory device.

7. The method of claim 1 , further comprising applying said voltage wave-form to said non-volatile memory device in response to stress induced leakage current (SILC) in said non-volatile memory device.

8. The method of claim 1 , wherein said electric field inhibits electrons on said floating gate from tunneling to said substrate.

9. A method comprising:

operating a non-volatile memory device in a standby mode;

applying a voltage wave-form to a memory cell of said non-volatile memory device to generate an electric field between a floating gate of said memory cell and a substrate of said non-volatile memory device while said non-volatile memory device is operating in said standby mode; and

applying said voltage wave-form to a block of memory cells of said non-volatile memory device during said standby mode operation, wherein said voltage wave-form comprises a first amplitude portion having a first time span and a second amplitude portion having a second time span, and wherein said first and second time spans are based, at least in part, on a thickness of an oxide layer between said floating gate and said substrate.

10. An apparatus comprising:

a non-volatile memory cell array including a memory cell having a floating gate; and

a controller to apply a voltage wave-form to said memory cell to generate an electric field between said floating gate and a substrate of said memory cell during a set state in said memory cell during a standby mode operation of said memory cell, wherein said set state corresponds to said floating gate being negatively charged.

11. The apparatus of claim 10 , wherein said memory cell array comprises a flash memory cell array.

12. The apparatus of claim 10 , wherein said voltage wave-form comprises a square wave voltage, wherein said square wave voltage includes a positive voltage portion and a negative voltage portion.

13. The apparatus of claim 10 , wherein said voltage wave-form comprises a pulsed voltage to generate a pulsed electric field between said floating gate and said substrate of said memory cell.

14. The apparatus of claim 10 , wherein said voltage wave-form is applied via a body of said memory cell.

15. The apparatus of claim 10 , further comprising sequentially applying said voltage wave-form to individual word-lines of said non-volatile memory device.

16. The apparatus of claim 10 , further comprising applying said voltage wave-form to said non-volatile memory device in response to stress induced leakage current (SILC) in said non-volatile memory device.

17. The apparatus of claim 10 , further comprising

a processor to host one or more applications and to initiate programming said non-volatile memory cell array.

18. An apparatus comprising:

means for operating a non-volatile memory device in a standby mode; and

means for applying a voltage wave-form to a memory cell of said non-volatile memory device to generate an electric field between a floating gate of said memory cell and a substrate of said non-volatile memory device to inhibit electrons on said floating gate from tunneling to said substrate while storing a “0” state in said memory cell and during said standby mode operation, wherein said “0” state corresponds to said floating gate being negatively charged.

19. The apparatus of claim 18 , wherein said non-volatile memory device comprises a flash memory device.

20. The apparatus of claim 19 , further comprising:

means for storing a “0” state in said memory cell, wherein said “0” state corresponds to a negatively charged floating gate responsive at least in part to said voltage wave-form.

21. The method of claim 18 , further comprising:

means for applying said voltage wave-form to a block of memory cells of said non-volatile memory device during said standby mode operation, wherein said voltage wave-form comprises a first amplitude portion having a first time span and a second amplitude portion having a second time span, and wherein said first and second time spans of said voltage wave-form are based, at least in part, on a thickness of an oxide layer between said floating gate and said substrate.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027126/0176 →