Thin semiconductor package and method for manufacturing same
View Patent ↗A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
1. A method for manufacturing a thin semiconductor package, comprising:
providing a lead frame with a removable substrate, the removable substrate having an attaching surface that is attached to a first surface of the lead frame, the lead frame being formed from an electrically conductive sheet, wherein the lead frame has a plurality of leads extending inwardly from a lead frame boundary towards a central region of the lead frame;
mounting a semiconductor die on the removable substrate at the central region, the semiconductor die having a connection pad surface with die pads thereon, wherein the connection pad surface is attached to the attaching surface of the removable substrate;
encapsulating the lead frame and semiconductor die with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate;
removing the removable substrate from the lead frame to expose the first surface of the lead frame;
electrically connecting the die pads to respective ones of the plurality of leads;
encapsulating the semiconductor die and the lead frame with a second encapsulant so that the semiconductor die and the lead frame are sandwiched between the second encapsulant and first encapsulant; and
removing at least part of the first encapsulant to at least partially expose the leads.
2. The method of claim 1 , wherein the mounting is characterized by the removable substrate being a film with an adhesive on the attaching surface, and wherein the adhesive attaches the connection pad surface of the semiconductor die to the removable substrate.
3. The method of claim 1 , wherein the semiconductor die has a height no greater than a height of the lead frame.
4. The method of claim 1 , wherein the removing includes grinding the first encapsulant.
5. The method of claim 1 , wherein the removing includes etching the first encapsulant.
6. The method of claim 1 , wherein the encapsulating the lead frame and semiconductor die with a first encapsulant is further characterized by the semiconductor die and the lead frame being sandwiched between the first encapsulant and the removable substrate.
7. The method of claim 1 , wherein the first encapsulant and the second encapsulant are mold compounds.
8. The method of claim 1 , further comprising a step of singulating the leads from the lead frame boundary.
9. The method of claim 1 , wherein the thin semiconductor package is a flagless quad flat package having four sides, wherein some of the leads are positioned along each of the four sides.
10. The method of claim 2 , wherein the adhesive attaches the die pads of the semiconductor die to the removable substrate.
11. The method of claim 10 , further including a step of cleaning the die pads before the electrically connecting step.
12. The method of claim 4 , wherein the removing includes grinding at least a portion of the semiconductor die.
13. The method of claim 5 , the semiconductor die has a height greater than a height of the lead frame.
14. A thin semiconductor package manufactured by a method comprising:
providing a lead frame with a removable substrate, the removable substrate having an attaching surface that is attached to a first surface of the lead frame, the lead frame being formed from an electrically conductive sheet, wherein the lead frame has a plurality of leads extending inwardly from a lead frame boundary towards a central region of the lead frame;
mounting a semiconductor die on the removable substrate at the central region, the semiconductor die having a die pad surface with die pads thereon, wherein the die pad surface is attached to the attaching surface of the removable substrate;
encapsulating the lead frame and the semiconductor die with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate;
removing the removable substrate from the lead frame to expose the first surface of the lead frame;
electrically connecting the die pads to respective ones of the plurality of leads;
encapsulating the semiconductor die and the lead frame with a second encapsulant so that the lead frame and semiconductor die are sandwiched between the first and second encapsulants; and
removing at least part of the first encapsulant to expose at least a portion of the leads.
15. The thin semiconductor package of claim 14 , wherein the thin semiconductor package is a flagless quad flat package having four sides, wherein some of the leads are positioned along each of the four sides.
16. The thin semiconductor package of claim 14 , wherein the semiconductor die has a height that is no greater than a height of the lead frame.
17. The thin semiconductor package of claim 14 , the semiconductor die has a height that is greater than a height of the lead frame.
18. The thin semiconductor package of claim 14 , wherein the removable substrate comprises a film with an adhesive on the attaching surface, and wherein the adhesive attaches the die pad surface of the semiconductor die to the removable substrate.
19. The thin semiconductor package of claim 14 , wherein a portion of the semiconductor die is removed.