Method of manufacturing a multi-layer substrate
Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.
1. A manufacturing method of a multi-layer substrate, comprising steps of:
a. providing a carrier;
b. coating a first dielectric layer on the carrier;
c. drying the first dielectric layer to harden thereof;
c1. making at least one via in the first dielectric layer, so as to be a solder mask layer;
d. forming a metal structure layer on the first dielectric layer;
e. coating a second dielectric layer on the metal structure layer;
f. drying the second dielectric layer to harden thereof; and
g. separating the multi-layer substrate from the carrier.
2. The manufacturing method of claim 1 , further comprising a step of repeating step d to step f, to stack up the second dielectric layers and the metal structure layers alternately and the second dielectric layers adhere respectively to embed the metal structure layers in the second dielectric layers corresponding thereto.
3. The manufacturing method of claim 2 , further comprising a step of making at least one via in the second dielectric layers to connect the metal structure layers adjacent therewith after each step f.
4. The manufacturing method of claim 2 , further comprising a step of implementing an interface adhesion enhancing process to increase adhesion intensities therebetween before each step e.
5. The manufacturing method of claim 4 , wherein the interface adhesion enhancing process is a plasma treatment process.
6. The manufacturing method of claim 1 , further comprising a step of implementing an interface adhesion enhancing process to increase adhesion intensity between the first dielectric layer and the second dielectric layer before step e.
7. The manufacturing method of claim 6 , wherein the interface adhesion enhancing process is a plasma treatment process.
8. The manufacturing method of claim 1 , wherein step e is to make laterals of the metal structure layers bond closely with the second dielectric layers corresponding thereto.
9. A manufacturing method of a multi-layer substrate, comprising steps of:
a. providing a carrier;
b. coating a first dielectric layer on the carrier;
c. drying the first dielectric layer to harden thereof;
d. forming a metal structure layer on the first dielectric layer;
e. coating a second dielectric layer on the metal structure layer;
f. drying the second dielectric layer to harden thereof;
g. separating the multi-layer substrate from the carrier; and
g1. making at least one via in the first dielectric layer, so as to be a solder mask layer.