Patent Assignment
Reel/Frame 054228/0040
Assignment of Assignor's Interest
Recorded: 2020-10-30
Pages: 5
Assignor
PRINCO MIDDLE EAST FZE
Executed: 2020-10-19
Assignee
PRINCO CORP.
NO. 6, CREATION 4TH RD. HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Properties
(25)
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Hybrid Structure of Multi-Layer Substrates and Manufacture Method Thereof
Method of Manufacturing Hybrid Structure of Multi-Layer Substrates
Surface Finish Structure of Multi-Layer Substrate and Manufacturing Method Thereof
Multi-Layer Substrate and Manufacturing Method Thereof
Multi-Layer Substrate and Manufacture Method Thereof
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Substrate with Multi-Layer Interconnection Structure and Method of Manufacturing the Same
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Method of Manufacturing Hybrid Structure of Multi-Layer Substrates and Hybrid Structure Thereof
Manufacturing Method of Metal Structure in Multi-Layer Substrate and Structure Thereof
Via Structure in Multi-Layer Substrate
Metal Structure of Flexible Multi-Layer Substrate and Manufacturing Method Thereof
Hybrid Structure of Multi-Layer Substrates and Manufacture Method Thereof
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Method of Manufacturing a Multi-Layer Substrate
Multi-Layer via Structure
Manufacturing Method of Metal Structure in Multi-Layer Substrate
Manufacturing Method of Metal Structure of Flexible Multi-Layer Substrate
Package Method for Electronic Components by Thin Substrate
Package Method for Electronic Components by Thin Substrate
Testing Device and Testing Method Thereof
Chip Thermal Dissipation Structure
Electrical System and Core Module Thereof
Chip Thermal Dissipation Structure
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 20, 2006
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 018283/0293 →
Assignment of Assignor's Interest
Sep 18, 2007
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 019840/0011 →
Assignment of Assignor's Interest
Sep 18, 2007
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 019840/0171 →
Assignment of Assignor's Interest
Dec 5, 2007
From: YANG, CHIH-KUANG; HSING, CHIEH-LIN
To: PRINCO CORP.
Reel/Frame 020199/0543 →
Assignment of Assignor's Interest
Dec 19, 2007
From: YANG, CHIH-KUANG; CHANG, CHENG-YI
To: PRINCO CORP.
Reel/Frame 020272/0097 →
Assignment of Assignor's Interest
Jan 10, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 020426/0340 →
Assignment of Assignor's Interest
May 15, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 020952/0231 →
Assignment of Assignor's Interest
Jul 9, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 021211/0846 →
Assignment of Assignor's Interest
Nov 7, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 021806/0312 →
Assignment of Assignor's Interest
Aug 27, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023159/0226 →
Assignment of Assignor's Interest
Sep 3, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023191/0231 →
Assignment of Assignor's Interest
Oct 20, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023398/0944 →
Assignment of Assignor's Interest
Jul 4, 2010
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 024661/0557 →
Assignment of Assignor's Interest
Apr 22, 2011
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 026171/0573 →
Assignment of Assignor's Interest
Jul 25, 2012
From: PRINCO CORP.
To: PRINCO MIDDLE EAST FZE
Reel/Frame 028640/0443 →
Assignment of Assignor's Interest
Jul 26, 2012
From: PRINCO CORP.
To: PRINCO MIDDLE EAST FZE
Reel/Frame 028653/0131 →
Assignment of Assignor's Interest
Jul 31, 2012
From: PRINCO CORP.
To: PRINCO MIDDLE EAST FZE
Reel/Frame 028684/0693 →