IP Library › Assignment 028653/0131
Patent Assignment
Reel/Frame 028653/0131

Assignment of Assignor's Interest

Recorded: 2012-07-26 Pages: 2
Assignor
PRINCO CORP.
Executed: 2012-07-25
Assignee
PRINCO MIDDLE EAST FZE
OFFICE NO. LB 16416, P.O. BOX 18246, JEBEL ALI, DUBAI, UNITED ARAB EMIRATES
Covered Properties (5)
Via Structure in Multi-Layer Substrate
Patent: 9,107,315 →
Application: 12/582,647 →
Publication: US 2010/0108363
Metal Structure of Flexible Multi-Layer Substrate and Manufacturing Method Thereof
Patent: 8,373,070 →
Application: 12/830,321 →
Publication: US 2011/0088929
Multi-Layer via Structure
Patent: 8,405,223 →
Application: 13/092,895 →
Publication: US 2012/0007254
Via Structure in Multi-Layer Substrate and Manufacturing Method Thereof
Application: 13/345,705 →
Publication: US 2012/0107745
Manufacturing Method of Metal Structure of Flexible Multi-Layer Substrate
Patent: 9,398,704 →
Application: 13/541,664 →
Publication: US 2012/0270158
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023398/0944 →
Assignment of Assignor's Interest Jul 4, 2010
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 024661/0557 →
Assignment of Assignor's Interest Apr 22, 2011
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 026171/0573 →
Assignment of Assignor's Interest Oct 30, 2020
From: PRINCO MIDDLE EAST FZE
To: PRINCO CORP.
Reel/Frame 054228/0040 →