IP Library › Assignment 028684/0693
Patent Assignment
Reel/Frame 028684/0693

Assignment of Assignor's Interest

Recorded: 2012-07-31 Pages: 4
Assignor
PRINCO CORP.
Executed: 2012-07-25
Assignee
PRINCO MIDDLE EAST FZE
OFFICE NO.LB 16416, P.O.BOX 18246, JEBEL, ALI, DUBAI, UNITED ARAB EMIRATES
Covered Properties (14)
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Patent: 7,545,042 →
Application: 11/533,762 →
Publication: US 2007/0145602
Hybrid Structure of Multi-Layer Substrates and Manufacture Method Thereof
Patent: 8,023,282 →
Application: 11/856,858 →
Publication: US 2008/0138575
Method of Manufacturing Hybrid Structure of Multi-Layer Substrates
Patent: 7,687,312 →
Application: 11/856,867 →
Publication: US 2008/0136021
Surface Finish Structure of Multi-Layer Substrate and Manufacturing Method Thereof
Patent: 8,294,039 →
Application: 11/950,816 →
Publication: US 2008/0289863
Multi-Layer Substrate and Manufacture Method Thereof
Patent: 7,656,679 →
Application: 11/972,554 →
Publication: US 2008/0316726
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Patent: 7,947,573 →
Application: 12/121,037 →
Publication: US 2008/0213944
Substrate with Multi-Layer Interconnection Structure and Method of Manufacturing the Same
Patent: 8,051,557 →
Application: 12/169,830 →
Publication: US 2008/0265405
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Patent: 7,993,973 →
Application: 12/267,374 →
Publication: US 2009/0061565
Method of Manufacturing Hybrid Structure of Multi-Layer Substrates and Hybrid Structure Thereof
Patent: 7,948,079 →
Application: 12/549,289 →
Publication: US 2009/0314524
Manufacturing Method of Metal Structure in Multi-Layer Substrate and Structure Thereof
Patent: 7,931,973 →
Application: 12/553,604 →
Publication: US 2009/0321115
Hybrid Structure of Multi-Layer Substrates and Manufacture Method Thereof
Patent: 8,111,519 →
Application: 13/015,725 →
Publication: US 2011/0124154
Hybrid Structure of Multi-Layer Substrates and Manufacture Method Thereof
Patent: 8,014,164 →
Application: 13/015,739 →
Publication: US 2011/0124155
Structure Combining an Ic Integrated Substrate and a Carrier, and Method of Manufacturing Such Structure
Patent: 8,288,246 →
Application: 13/018,451 →
Publication: US 2011/0129964
Manufacturing Method of Metal Structure in Multi-Layer Substrate
Patent: 8,815,333 →
Application: 13/447,326 →
Publication: US 2012/0202159
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 20, 2006
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 018283/0293 →
Assignment of Assignor's Interest Sep 18, 2007
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 019840/0171 →
Assignment of Assignor's Interest Sep 18, 2007
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 019840/0011 →
Assignment of Assignor's Interest Dec 5, 2007
From: YANG, CHIH-KUANG; HSING, CHIEH-LIN
To: PRINCO CORP.
Reel/Frame 020199/0543 →
Assignment of Assignor's Interest Jan 10, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 020426/0340 →
Assignment of Assignor's Interest May 15, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 020952/0231 →
Assignment of Assignor's Interest Jul 9, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 021211/0846 →
Assignment of Assignor's Interest Nov 7, 2008
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 021806/0312 →
Assignment of Assignor's Interest Aug 27, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023159/0226 →
Assignment of Assignor's Interest Sep 3, 2009
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 023191/0231 →
Assignment of Assignor's Interest Apr 16, 2012
From: YANG, CHIH-KUANG
To: PRINCO CORP.
Reel/Frame 028048/0751 →
Assignment of Assignor's Interest Oct 30, 2020
From: PRINCO MIDDLE EAST FZE
To: PRINCO CORP.
Reel/Frame 054228/0040 →