Granted Patent B1

US 8,252,631 · App. 13/096,269 · Granted Aug 28, 2012

Abstract

Claims (29)

1. A method comprising:

applying a lead-free die attach material to a surface on a leadframe;

positioning an electronic die on the die attach material;

annealing the die attach material to form an oxide of at least a specified thickness over an exposed portion of the die attach material; and

applying an encapsulant material over the surface, the oxide, and the electronic die, wherein the oxide prevents the die attach material from wicking into a delamination void between the leadframe surface and the encapsulant material, wherein the die attach material is annealed at a temperature in a range between 150 and 300 degrees Centigrade for a duration between 30 seconds and 30 minutes in presence of an oxygen atmosphere.

2. The method of claim 1 wherein the die attach material includes tin (Sn).

3. The method of claim 1 wherein the thickness of the oxide is at least 50 nanometers.

4. The method of claim 1 wherein the die attach material is annealed at a temperature greater than 232 degrees Centigrade.

5. The method of claim 1 wherein the die attach material is annealed at an oxygen partial pressure ranging between 0.00001 and 0.21 atmosphere.

6. The method of claim 1 wherein the surface is a copper leadframe and the die attach material is annealed at a temperature in a range between 200 and 300 degrees Centigrade for a duration between 30 seconds and 5 minutes.

7. The method of claim 1 wherein the surface is a copper leadframe and the die attach material is annealed at a temperature in a range between 200 and 300 degrees Centigrade for a duration between 30 seconds and 5 minutes at an oxygen partial pressure ranging between 0.10 and 0.30 atmosphere.

8. The method of claim 1 wherein the surface is a pre-plated leadframe and the die attach material is annealed at a temperature in a range between 200 and 300 degrees Centigrade for a duration between 30 seconds and 30 minutes at an oxygen partial pressure ranging between 0.10 and 0.30 atmosphere.

9. The method of claim 1 further comprising forming wire bonds between the electronic die and the surface.

10. The method of claim 1 wherein the die attach material includes less than 10% lead by weight.

11. A packaged semiconductor device comprising:

a die attach material having less than 10 wt. % lead applied to a surface on a copper leadframe;

an electronic die positioned on the die attach material;

an oxide formed over an exposed portion of the die attach material; and

an encapsulant material applied over the surface, the oxide, and the electronic die, wherein the oxide is formed by annealing the die attach material in an oxygen atmosphere at a range between 150 and 300 degrees Centigrade for a duration between 30 seconds and 30 minutes to form the oxide thickness of at least 40 nanometers.

12. The device of claim 11 wherein the die attach material includes tin (Sn).

13. The device of claim 11 further comprising wire bonds formed between the electronic die and the surface.

14. A method comprising:

applying a lead-free die attach material to a surface;

positioning an electronic die on the die attach material;

forming an oxide of at least a specified thickness over an exposed portion of the die attach material;

forming wire bonds between the electronic die and the surface; and

applying an encapsulant material over the surface, the oxide, and the electronic die, wherein the die attach material is annealed at a temperature in a range between 150 and 300 degrees Centigrade for a duration between 30 seconds and 30 minutes in presence of an oxygen atmosphere to form the oxide.

15. The method of claim 14 wherein the thickness of the oxide is at least 50 nanometers.

16. The method of claim 14 wherein the surface is at least one of the group consisting of: a copper leadframe and a pre-plated leadframe.

Assignments (22)