Embedded protection against spurious electrical events
Various disclosed aspects provide for protecting components (e.g., integrated circuits) from spurious electrical overvoltage events, such as electrostatic discharge. Embedded components with voltage switchable dielectric materials may protect circuits against electrostatic discharge.
1. A circuit for protecting an electronic component of an electronic device against an overvoltage signal, the circuit comprising: a voltage switchable dielectric (VSD) material embedded in a substrate, the VSD material disposed between a first point located along an expected electrostatic discharge (ESD) signal path and a second point located within the device, the VSD material having a characteristic voltage level; a circuit element disposed between the first point and the electronic component, the circuit element comprises a filter and the filter is disposed in a vial; and a first conductor pad and a second conductor pad separated by a gap, wherein the first and second conductor pads are disposed on a surface of the VSD material, wherein the VSD material is configured to transmit to the second point a first portion of the overvoltage signal present at the first point when a voltage of the overvoltage signal exceeds the characteristic voltage level, and wherein the circuit element is configured to transmit a second portion of the overvoltage signal to the electronic component while modifying at least one signal characteristic of the second portion of the ESD signal, and
wherein the VSD material is configured to couple current across the gap from the first conductor pad to the second conductor pad when a voltage of the overvoltage signal exceeds the characteristic voltage level.
2. The circuit of claim 1 , wherein the second point located within the device is a ground or is in electrical communication to a ground signal level.
3. The circuit of claim 1 , wherein the second point located within the device is electrically coupled to an electronic component other than the component that receives the second portion of the overvoltage signal from the circuit element.
4. The circuit of claim 1 , wherein the substrate is a PCB and the VSD material is at least a part of a layer of the PCB.
5. The circuit of claim 4 , wherein the layer of the PCB including the VSD material is inside the PCB or is at a surface of the PCB.
6. The circuit of claim 1 , wherein the filter is a low-pass filter, a band-pass filter, or a high-pass filter.
7. The circuit of claim 1 , wherein the circuit element is embedded in the substrate.
8. The circuit of claim 1 , wherein the VSD material is further configured to protect the circuit element against the overvoltage signal.
9. The circuit of claim 1 , wherein the circuit is incorporated in a connector.
10. The circuit of claim 1 , wherein the substrate and the circuit element are part of a connector, and the component is part of a device to which the connector is attached.
11. The circuit of claim 1 , wherein the device is a mobile phone, electronic tablet, electronic reader, mobile computer, desktop computer, server computer, television set, music player, personal health management device, or another consumer electronic device that processes or stores data using electrical or electromechanical signals.
12. The circuit of claim 1 , wherein the at least one signal characteristic that the circuit element is configured to modify includes any of a voltage value, a current intensity value, a power value, a frequency value, a bandwidth value, and a propagation delay value.
13. An electronic device comprising: a substrate; a component disposed on the substrate; a voltage switchable dielectric material (VSD material) embedded in the substrate; a circuit element electrically connected to the VSD material and to the component, the circuit element separating the VSD material and the component, the circuit element comprises a filter and the filter is disposed in a via; and a first conductor pad and a second conductor pad separated by a gap, wherein the first and second conductor pads are disposed on a surface of the VSD material, and wherein the VSD material is configured to become substantially conductive when an input signal reaching the circuit element exceeds a characteristic voltage level of the VSD material, the VSD material thereby preventing at least a portion of the input signal from propagating to the component through the circuit element, and
wherein the VSD material is configured to couple current across the gap from the first conductor pad to the second conductor pad when a voltage of the overvoltage signal exceeds the characteristic voltage level.
14. The electronic device of claim 13 , wherein the substrate is a PCB and the VSD material comprises at least a portion of a layer of the PCB.
15. The electronic device of claim 13 , wherein the circuit element is embedded within the substrate.
16. The electronic device of claim 13 , wherein the device is a mobile phone, electronic tablet, electronic reader, mobile computer, desktop computer, server computer, television set, music player, personal health management device, or another consumer electronic device that processes or stores data using electrical or electromechanical signals.
17. The electronic device of claim 13 , wherein the circuit element is configured to transmit a portion of input signal to the electronic component while modifying at least one signal characteristic of the transmitted portion of the input signal.
18. The electronic device of claim 13 , wherein the component includes any of a chip, an integrated circuit, a semiconductor, a resistor, an inductor, a capacitor, and a diode.