IP Library Granted Patent US 8,740,456
Granted Patent B2
US 8,740,456 · App. 13/109,446 · Granted Jun 3, 2014

Adjusting delivery of current in a connection based on temperature

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,740,456
App. No.
13/109,446
Granted
Jun 3, 2014
Kind
B2
Abstract

Adjusting current based on temperature. A change in temperature of a connection between a first device and a second device may be measured. The change in temperature may be performed while the first device provides current to the second device over the connection. If the change in temperature is above a threshold, the current being provided from the first device to the second device may be reduced. The change in temperature may be performed by the first device and/or the second device, e.g., by measuring the temperature of a connector of the connection.

Claims (42)

1. A method for adjusting current based on temperature, comprising:

determining a change temperature at a first device wherein said temperature is measured at a first port of the first device that is configured to receive a connection to a second device;

determining a change temperature at a second device wherein said temperature is measured at a second port of the second device that is configured to receive the connection to the first device;

determining the greater of the changes in temperature measured at the first device and the second device, wherein said determining is performed while the first device provides current to the second device over the connection;

determining if the greater of the changes in temperature is above a threshold;

if the greater of the changes in temperature is above the threshold, reducing the current being provided from the first device to the second device.

2. The method of claim 1 , wherein said determining the change in temperature, said determining if the change in temperature is above the threshold, and said reducing the current is performed a plurality of times while the first device provides current to the second device over the connection.

3. The method of claim 1 , wherein said determining the change in temperature comprises:

determining an ambient temperature at the first device;

determining a temperature of a first connector of the connection; and

determining the difference between the ambient temperature and the temperature of the first connector of the connection.

4. The method of claim 1 , wherein said determining the change in temperature comprises:

determining an initial temperature of a first connector of the connection at a first time;

determining a current temperature of the first connector of the connection at a second time; and

determining the difference between the initial temperature and the current temperature.

5. The method of claim 1 , wherein said determining the change in temperature comprises:

determining a temperature of a first connector of the connection by measuring a temperature of an electrical assembly connected to the first connector of the first device or the second device.

6. The method of claim 1 , wherein said determining the change in temperature comprises:

determining a temperature near a power pin of the first connector of the connection.

7. The method of claim 1 , wherein said determining the change in temperature comprises:

determining a temperature near a data pin of the first connector of the connection.

8. The method of claim 1 , wherein said reducing the current is performed by the first device.

9. A device, comprising:

a connection coupling a first device and a second device;

a first port of the first device, wherein the first port is configured to receive a first connector of the connection;

first logic of the first device coupled to the first port, wherein the first logic is configured to determine a temperature of the connection at the first connector;

second logic of the first device, wherein the second logic is configured to provide current to the second device over the connection;

a second port of the second device, wherein the second port is configured to receive a second connector of the connection;

third logic of the second device coupled to the second port, wherein the third logic is configured to determine a temperature of the connection at the second connector;

wherein, in response to the greater of the change in temperature determined by the first logic and the change in temperature determined by the third logic being above a threshold, the second logic is configured to reduce the current being provided from the first device to the second device.

10. The device of claim 9 , wherein said first logic is configured to:

determine an ambient temperature at the first device; and

determine the difference between the ambient temperature and the temperature of the first connector of the connection.

11. The device of claim 9 , wherein said first logic is configured to:

determine an initial temperature of the first connector of the connection at a first time;

determine a current temperature of the first connector of the connection at a second time; and

determine the difference between the initial temperature and the current temperature.

12. The device of claim 9 , wherein said first logic is configured to:

determine a temperature of the first connector of the connection by measuring a temperature of the port.

13. The device of claim 9 , wherein said first logic is configured to:

determine a temperature near a power pin of the first connector of the connection; or

determine a temperature near a data pin of the first connector of the connection.

Assignments (10)
CONFIRMATORY ASSIGNMENT Recorded Sep 7, 2022
From: MICROCHIP TECHNOLOGY INCORPORATED; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICREL LLC; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROCHIP TECHNOLOGY CALDICOT LIMITED
To: POLARIS POWERLED TECHNOLOGIES, LLC
Reel/Frame 061374/0137 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2011
From: MONKS, MORGAN H.; GAY, KENNETH W.; KNOWLTON, TIMOTHY J.
To: SMSC HOLDINGS S.A.R.L.
Reel/Frame 026292/0053 →