Plasma processing apparatus
A plasma processing apparatus ( 5 ) comprises an outer shell ( 51 ) which is provided with a reaction chamber ( 52 ) in the interior, a bottom electrode which is arranged in the reaction chamber ( 52 ) and a cantilever support device ( 53 ) which goes through the outer shell ( 51 ) and supports the bottom electrode. The cantilever support device ( 53 ) is pivotally mounted on the side wall of the outer shell ( 51 ) and can rotate in the outer shell ( 51 ). The plasma processing apparatus ( 5 ) further comprises a locating device so as to selectively fix the relative position of the cantilever support device ( 53 ) and the outer shell ( 51 ).
1. A plasma processing apparatus comprising:
an outer shell provided with a reaction chamber in the interior; a side wall of the outer shell being provided with a circular stepped hole having a step plane facing towards the outside;
a bottom electrode arranged in the reaction chamber, a top of the bottom electrode being provided with a support element to support a workpiece, and a bottom of the bottom electrode being provided with a detachable cover board; and
a cantilever support device laterally going through the side wall of the outer shell, the cantilever support device having a circular step plane, and the circulars plane being received by the stepped hole of the side wall, an inner end of the cantilever support device being located in the reaction chamber and supporting the bottom electrode; characterized in that the cantilever support device is pivotally mounted on the side wall of the outer shell so as to rotate in the outer shell to drive the bottom electrode to rotate in the reaction chamber; the plasma processing apparatus further comprises a locating device for fixing a relative position of the cantilever support device to a position of the outer shell during the maintenance operation so as to switch the bottom electrode between at least a maintenance state and a process state; wherein in the process state, the support element is disposed upwards for process operation to the workpiece, and in the maintenance state, the cover board is disposed upwards for a maintenance operation to the bottom electrode.
2. The plasma processing apparatus according to claim 1 , characterized in that the cantilever support device is pivotally mounted on the side wall of the outer shell by a bearing.
3. The plasma processing apparatus according to claim 2 , characterized in that a sealing component is arranged between the cantilever support device and the outer shell.
4. The plasma processing apparatus according to claim 3 , characterized in that the bearing is arranged in the circular stepped hole; the sealing component is particularly a sealing ring and is arranged between the cantilever support device and the step plane of the circular stepped hole.
5. The plasma processing apparatus according to claim 2 , characterized in that the bearing is a magnetic fluid sealing bearing.
6. The plasma processing apparatus according to claim 1 , characterized in that the cross section of a part of the cantilever support device located in the reaction chamber has a shape of circle.
7. The plasma processing apparatus according to claim 1 , characterized in that the cross section of a part of the cantilever support device located in the reaction chamber has substantially a shape of ellipse, and the major axis of the ellipse substantially vertically extends under a normal operation state.
8. The plasma processing apparatus according to claim 1 , characterized in that the cantilever support device comprises a cavity extending along the axis direction of the cantilever support device in the interior, and the cavity is communicated with an inner cavity of the bottom electrode.
9. The plasma processing apparatus according to claim 1 , characterized in that the locating device includes a flange part fixed on an outer end of the cantilever support device, and the flange part and the outer shell are respectively provided with locating pins and pin-holes matching each other.