Method for singulating electronic components from a substrate
View Patent ↗Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate.
1. A method for forming electronic assemblies comprising:
encapsulating electronic components within a device panel;
attaching the device panel to a carrier substrate using an adhesive material, the carrier substrate having a plurality of openings therethrough at the time of said attaching, wherein the carrier substrate is below the entirety of the device panel and supports the device panel, and the carrier substrate has a width greater than or equal to that of the device panel;
forming a plurality of cuts through the device panel to divide the device panel into a plurality of device panel portions, each device panel portion comprising at least one of the electronic components and being aligned with one of the openings through the carrier substrate, wherein each cut of the plurality of cuts extends into the adhesive material but not into the carrier substrate; and
inserting at least one ejection member through openings in the carrier substrate from a side opposite the device panel to lift the plurality of device panel portions from the carrier substrate.
2. The method of claim 1 , further comprising forming a plurality of insulating layers and contact formations on a side of the device panel opposing the carrier substrate after the attaching the device panel to the carrier substrate, each of the contact formations being electrically connected to a respective electronic component.
3. The method of claim 2 , wherein each of the plurality of electronic devices comprises a microelectronic die having an integrated circuit formed thereon.
4. The method of claim 3 , wherein the plurality of device panel portions have a portion width and the microelectronic die have a die width, the portion width being greater than the die width.
5. A method for forming microelectronic assemblies comprising:
encapsulating a plurality of microelectronic die in an encapsulation material to form a device panel, each of the plurality of microelectronic die having an integrated circuit formed thereon and having a die width;
attaching the device panel to a carrier substrate using an adhesive material, wherein the carrier substrate has a plurality of openings therethrough, the carrier substrate is below the entirety of the device panel and supports the device panel, and the carrier substrate has a width greater than or equal to that of the device panel;
forming a plurality of cuts through the device panel to divide the device panel into a plurality of device panel portions, each of the plurality of device panel portions comprising at least one of the plurality of microelectronic die, being aligned with one of the plurality of openings through the carrier substrate, and having a portion width that is greater than the die width and the plurality of cuts extending completely through the device panel and partially into the adhesive material and do not extend into the carrier substrate; and
inserting at least one ejection member through openings in the carrier substrate from a side opposite the device panel to remove the plurality of device panel portions from the carrier substrate.
6. The method of claim 5 , further comprising forming a plurality of insulating layers and contact formations on a side of the device panel opposing the carrier substrate after the attaching the device panel to the carrier substrate, each of the contact formations being electrically connected to a respective microelectronic die.
7. The method of claim 6 , wherein the adhesive material is a solvent soluble adhesive and the adhesive material is not exposed to a solvent in which the solvent soluble adhesive dissolves before device panel portions are removed from the carrier substrate.