Nanostructured device
View Patent ↗A nanostructured device according to the invention comprises a first group of nanowires protruding from a substrate where each nanowire of the first group of nanowires comprises at least one pn- or p-i-n-junction. A first contact, at least partially encloses and is electrically connected to a first side of the pn- or p-i-n-junction of each nanowire in the first group of nanowires. A second contacting means comprises a second group of nanowires that protrudes from the substrate, and is arranged to provide an electrical connection to a second side of the pn- or p-i-n-junction.
1. A nanostructured device comprising:
a first group of nanowires protruding from a substrate where each nanowire of the first group of nanowires comprises at least one pn- or p-i-n-junction,
a first contacting feature that at least partially encloses and electrically connects to a first side of the pn- or p-i-n-junction of each nanowire in the first group of nanowires, and
a second contacting feature, which comprises a second group of nanowires that protrudes from the substrate, and which is arranged to provide an electrical connection to a second side of the pn or p-i-n junction of each nanowire in the first group of nanowires,
wherein the pn- or p-i-n junction of each nanowire in the first group of nanowires in operation provides an active region for charge carrier recombination for generation of light such that the nanostructured device functions as a LED device,
wherein the second contacting feature further comprises a second contact at least partly enclosing the nanowires of the second group of nanowires, and
wherein a pn- or p-i-n junction of each nanowire in the second group of nanowires is shorted by the second contact to render the second group of nanowires electrically inactive.
2. The nanostructured device according to claim 1 , wherein the substrate comprises a buffer layer adjacent to the nanowires.
3. The nanostructured device according to claim 1 , wherein the second contact is in direct electrical contact with at least one of the buffer layer or the substrate such that the electrical connection to the second side of the pn or p-i-n junction is provided at least partly via at least one of the buffer layer or the substrate.
4. The nanostructured device according to claim 3 , wherein each nanowire of the first and second groups of nanowires comprise a core and a shell layer that at least partly encloses the core, whereby a pn-junction or p-i-n-junction is formed by the core and the shell.
5. The nanostructured device according to claim 1 , wherein the second contact is in electrical contact with the core of the nanowires of the second group of nanowires such that the electrical connection to the second side of the pn or p-i-n junction is provided at least partly via the cores.
6. The nanostructured device according to claim 5 , wherein the second contact is electrically insulated from the buffer layer or the substrate, whereby the electrical connection to the second side of the pn- or p-i-n junction is provided via a conduction path extending from the second contact via the cores of the nanowires of the second group of nanowires to at least one of the buffer layer or the substrate, and to the second side of the pn- or p-i-n-junction.
7. The nanostructured device according to claim 1 , wherein each nanowire of the first and second groups of nanowires have been simultaneously grown in the same process step.
8. The nanostructured device according to claim 1 , wherein the first contacting feature is connected to the p-side and the second contacting feature is connected to the n-side.
9. The nanostructured device according to claim 1 , wherein a nanowire core is exposed and contacted in an end portion of the second group of nanowires.
10. Method of forming a nanostructured device comprising the steps of:
providing a substrate,
growing a first group of nanowires and a second group of nanowires on the substrate or a buffer layer on the substrate,
forming a pn- or p-i-n-junction in each of the nanowires of the first and second groups of nanowires,
forming a first contact that at least partially encloses and electrically connects to a first side of the pn or p-i-n junction of each nanowire in the first group of nanowires, and
forming a second contact that at least partly encloses the nanowires of the second group of nanowires, whereby the second contact forms part of an electrical connection to a second side of the pn- or p-i-n-junction of each nanowire in the first group of nanowires,
wherein the pn- or p-i-n junction of each nanowire in the first group of nanowires in operation provides an active region for charge carrier recombination for generation of light such that the nanostructured device functions as a LED device, and
wherein the pn- or p-i-n junction of each nanowire in the second group of nanowires is shorted by the second contact to render the second group of nanowires electrically inactive.
11. Method of forming a nanostructured device according to claim 10 , wherein the step of growing comprises growing a shell layer enclosing the nanowires.
12. Method of forming a nanostructured device according to claim 10 , wherein the step of forming the second contact comprises uncovering the nanowire from surrounding layers on the second group of nanowires, and forming a second contact that at least partly encloses the nanowires of the second group of nanowires.
13. Method of forming a nanostructured device according to claim 10 , wherein the second contact is in direct contact with at least one of the buffer layer or the substrate.
14. The method according to claim 10 , wherein the first and second groups of nanowires are formed simultaneously in the same process step.
15. The method of forming a nanostructured device according to claim 10 , wherein a nanowire core is exposed in an end portion of the second group of nanowires.
16. The method of forming a nanostructured device according to claim 15 , wherein a predefined portion of the nanowires of the first and second group of nanowires is removed using at least one of chemical mechanical polishing (CMP) or etching.