Granted Patent B2

US 8,947,887 · App. 13/142,857 · Granted Feb 3, 2015

Abstract

Claims (26)

1. A package assembly, comprising:

an electronic device;

a package body;

at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from said package body;

said first and said second plurality of leads arranged in at least a first row and a second row located in parallel to said first row; each of said rows comprising at least two leads;

said first row being transformable into said second row by mirroring said first row along a symmetry plane of said package body;

each of said first plurality of leads having said first geometrical shape different from said second geometrical shape; and

wherein a width of each of said first plurality of leads differs from a width of each of said second plurality of leads, wherein said width of each of said first plurality of leads is a sum of n times said width of one of said second plurality of leads plus (n−1) times a pitch between two neighboring leads of said second plurality of leads, n being an integer number.

2. The package assembly as claimed in claim 1 , wherein said electronic device is a semiconductor device.

3. The package assembly as claimed in claim 1 , wherein said first geometrical shape differs from said second geometrical shape only in one of three spatial directions being orthogonal to each other.

4. The package assembly as claimed in claim 1 , comprising a third plurality of leads having a third geometrical shape different from said first geometrical shape and said second geometrical shape.

5. The package assembly as claimed in claim 1 , wherein said electronic device comprises at least one sensor element.

6. The package assembly as claimed in claim 1 , wherein said package body is a pre-molded cavity package body.

7. The package assembly as claimed in claim 1 , wherein said package assembly is a surface mounted device (SMD).

8. The package assembly as claimed in claim 1 , wherein said first and second plurality of package leads are gull-wing shaped.

9. The package assembly as claimed in claim 1 , wherein said package assembly is a quad-flat package (QFP) assembly or a small outline package (SOP) assembly.

10. A sensor system, comprising a package assembly as claimed in claim 1 .

11. The package assembly as claimed in claim 3 , comprising a third plurality of leads having a third geometrical shape different from said first geometrical shape and said second geometrical shape.

12. The package assembly as claimed in claim 3 , wherein said electronic device comprises at least one sensor element.

13. A method of tuning a natural resonant frequency of a package, comprising:

providing an electronic device;

providing a package body;

providing at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from said package body;

providing each of said first plurality of leads having said first geometrical shape different from said second geometrical shape;

arranging said first and said second plurality of leads in at least a first row and a second row located in parallel to said first row; each of said rows comprising at least two leads; said first row being transformable into said second row by mirroring said first row along a symmetry plane of said package body; and

wherein a width of each of said first plurality of leads differs from a width of each of said second plurality of leads, wherein said width of each of said first plurality of leads is a sum of n times said width of one of said second plurality of leads plus (n−1) times a pitch between two neighboring leads of said second plurality of leads, n being an integer number.

Assignments (31)