Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer
View Patent ↗A method of packaging an electronic device includes providing a patterned dielectric layer with an area sized to receive a first die, and another area sized to receive a second die, placing the first and second dies within the first and second areas, encapsulating the dies with an encapsulating material that has a different composition from the dielectric layer, forming a first signal line between the dies, forming a second signal line to the first die, and forming an additional signal line to the first die. The dielectric layer is disposed between the first signal line and the encapsulating material, the electronic device transmits a signal in an approximate range of 1 GHz to 100 GHz along the second signal line, and a signal that does not exceed approximately 900 MHz along the additional signal line.
1. A method of packaging an electronic device, the method comprising:
providing a patterned dielectric layer, including a first area sized to receive a first die, and a second area sized to receive a second die;
placing the first die within the first area and the second die within the second area;
encapsulating the first die and the second die within an encapsulating material, wherein the encapsulating material has a different composition as compared to the dielectric layer;
forming a first signal line coupled to the first die and the second die, wherein the dielectric layer is disposed between the signal line and the encapsulating material;
forming a second signal line coupled to the first die, wherein the electronic device is operable to transmit a signal having a frequency within a range of from 1 GHz to 100 GHz along the second signal line; and
forming an additional signal line coupled to the first die, wherein the electronic device is operable to transmit a signal having a frequency that does not exceed 900 MHz along the additional signal line.
2. The method of claim 1 , wherein the electronic device is operable to transmit a signal having a frequency within a range of from 1 GHz to 100 GHz along the first signal line.
3. The method of claim 1 , further comprising forming a thru via that extends through the dielectric layer and the encapsulating material, wherein the first die is coupled to the thru via.
4. The method of claim 1 , further comprising forming a plurality of vias between the first die and the second die.
5. The method of claim 4 , further comprising connecting a first via of the plurality of vias and a second via of the plurality of vias to each other by a conductive layer, wherein the dielectric layer lies between the conductive layer and the encapsulating material.
6. The method of claim 4 , further comprising:
forming a patterned conductive layer, wherein the dielectric material is disposed between the conductive layer and the encapsulating material; and
wherein each of the plurality of vias is electrically connected with the conductive layer.
7. The method of claim 4 , wherein the plurality of vias are formed by laser drilling, chemical etching, or any combination thereof.
8. The method of claim 4 , further comprising filling the plurality of vias with a conductive material.
9. The method of claim 1 , wherein the second signal line is formed at approximately a same elevation as the first signal line.
10. The method of claim 1 , wherein the dielectric layer includes an organic material.
11. The method of claim 10 , wherein the dielectric layer comprises a composite of the organic material and a ceramic material.
12. The method of claim 10 , wherein a dielectric constant of the dielectric layer is within fifty percent of a dielectric constant of the encapsulating material.
13. The method of claim 12 , wherein the dielectric constant of the dielectric layer is within ten percent of the dielectric constant of the encapsulating material.
14. A method of packaging an electronic device, the method comprising:
providing a patterned dielectric layer, including a first open area, and a second open area;
placing a first die within the first open area and a second die within the second open area; and
encapsulating the first die and the second die within an encapsulating material, wherein the encapsulating material has a different composition as compared to the dielectric layer;
wherein a maximum attenuation constant of the electronic device is 0.15 dB/mm for electromagnetic signals having frequencies in a range of from 70 GHz to 90 GHz.
15. The method of claim 14 , wherein the dielectric layer is in a form of a dielectric plate.
16. The method of claim 14 , further comprising forming an electrically conductive carrier having a length substantially perpendicular to a width of the dielectric layer, the electrically conductive carrier contacting both the dielectric layer and the encapsulating material.
17. The method of claim 16 , wherein the electrically conductive carrier is adapted to electrically ground the electronic device and to shield the first die from electromagnetic interference.
18. The method of claim 17 , wherein the electrically conductive carrier is formed as a thru via.
19. The method of claim 18 , wherein the first die is coupled to the thru via.
20. A method of providing a signal line for an electronic device, the method comprising:
providing a patterned dielectric layer, including a first open area and a second open area;
placing a first die within the first open area and a second die within the second open area;
encapsulating a first non-active portion of the first die and a second non-active portion of the second die within an encapsulating material, wherein the encapsulating material has a different composition as compared to the dielectric layer;
forming the signal line such that the dielectric layer is disposed between the signal line and the encapsulating material, wherein the signal line is coupled to the first die and the second die, and the signal line is operable to transmit a signal having a frequency within a range of from 1 GHz to 100 GHz.