INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing a base substrate;

mounting an organic chip assembly on the base substrate, the organic chip assembly includes providing an assembly integrated circuit embedded in an organic cover, the organic cover having a through via, and the organic chip assembly having a vertical assembly side;

forming a molded underfill encapsulating the vertical assembly side, and between the organic chip assembly and the base substrate; and

removing a portion of the organic chip assembly and the molded underfill for forming a planarized assembly surface.

2 . The method as claimed in claim 1 wherein removing a portion of the organic chip assembly includes removing a portion of the organic cover for exposing a via conductor from the organic cover.

3 . The method as claimed in claim 1 further comprising mounting a stack package above the planarized assembly surface.

4 . The method as claimed in claim 1 wherein removing the portion of the organic chip assembly includes removing a portion of the organic cover for forming a planarized periphery surface.

5 . The method as claimed in claim 1 further comprising:

mounting an assembly connector between the base substrate and the organic chip assembly; and

wherein:

forming the molded underfill includes encapsulating the assembly connector with the molded underfill, the assembly connector exposed from the molded underfill at a first area between the base substrate and the assembly connector and at a second area between the organic chip assembly and the assembly connector.

6 . A method of manufacture of an integrated circuit packaging system comprising:

providing a base substrate;

mounting an organic chip assembly on the base substrate, the organic chip assembly includes providing an assembly integrated circuit embedded in an organic cover, the organic cover having a through via, and the organic chip assembly having a vertical assembly side;

forming a molded underfill encapsulating a vertical assembly side, and between the organic chip assembly and the base substrate;

removing a portion of the organic chip assembly and the molded underfill for forming a planarized assembly surface; and

mounting a stack package on the planarized assembly surface and above the organic chip assembly.

7 . The method as claimed in claim 6 wherein removing the portion of the organic chip assembly includes planarizing an inactive side of the organic chip assembly, the organic cover, and the molded underfill.

8 . The method as claimed in claim 6 further comprising:

mounting a redistribution layer on an inactive side of the assembly integrated circuit; and

mounting an intermediate flip chip on the redistribution layer.

9 . The method as claimed in claim 6 further comprising mounting a heat sink to an inactive side of the assembly integrated circuit.

10 . The method as claimed in claim 6 further comprising:

mounting an intermediate organic package above the planarized surface; and

wherein:

mounting a stack package includes mounting a stack flip chip package over the intermediate organic package.

11 . An integrated circuit packaging system comprising:

a base substrate;

an organic chip assembly mounted on the base substrate and having a planarized assembly surface, the planarized assembly surface includes an inactive side of an assembly integrated circuit coplanar to an organic cover with a through via, the organic chip assembly having a vertical assembly side; and

a molded underfill encapsulating the vertical assembly side, and between the organic chip assembly and the base substrate.

12 . The system as claimed in claim 11 wherein the through via includes a via conductor exposed from the organic cover.

13 . The system as claimed in claim 11 further comprising a stack package mounted above the planarized assembly surface.

14 . The system as claimed in claim 11 wherein the organic chip assembly includes a planarized periphery surface.

15 . The system as claimed in claim 11 further comprising an assembly connector mounted between the base substrate and the organic chip assembly, the assembly connector exposed from the molded underfill at a first area between the base substrate and the assembly connector and at a second area between the organic chip assembly and the assembly connector.

16 . The system as claimed in claim 11 further comprising a stack package mounted above the organic chip assembly.

17 . The system as claimed in claim 16 wherein the organic chip assembly includes an inactive side of the assembly integrated circuit, the organic cover, and the molded underfill all coplanar.

18 . The system as claimed in claim 16 further comprising:

a redistribution layer on an inactive side of the assembly integrated circuit; and

an intermediate flip chip on the redistribution layer.

19 . The system as claimed in claim 16 further comprising a heat sink mounted to an inactive side of the assembly integrated circuit.

20 . The system as claimed in claim 16 further comprising:

an intermediate organic package mounted above the planarized assembly surface; and

wherein:

the stack package is a stack flip chip package mounted over the intermediate organic package.