Integrated shield package and method
View Patent ↗An integrated shield electronic component package includes a substrate having an upper surface, a lower surface, and sides extending between the upper surface and the lower surface. An electronic component is mounted to the upper surface of the substrate. An integrated shield is mounted to the upper surface of the substrate and includes a side shielding portion directly adjacent to and covering the sides of the substrate. The integrated shield covers and provides an electromagnetic interference (EMI) shield for the electronic component, the upper surface and sides of substrate. Further, the integrated shield is integrated within the integrated shield electronic package. Thus, separate operations of mounting an electronic component package and then mounting a shield are avoided thus simplifying manufacturing and reducing overall assembly costs.
1. An integrated shield electronic component package assembly comprising:
a larger substrate comprising a first surface comprising terminals thereon;
an integrated shield electronic component package comprising:
a substrate comprising a first surface, a second surface, and sides extending between the first surface and the second surface;
terminals coupled to the second surface;
interconnection structures coupling the terminals of the second surface to the terminals of the larger substrate; and
an integrated shield of uniform thickness coupled to the first surface of the substrate and comprising a side shielding portion fully covering the sides of the substrate,
wherein there is no solder material at any portion of:
a first area between a first side of the substrate and a corresponding first side shielding portion of the integrated shield that faces the first side of the substrate, and
a second side area between a second side of the substrate and a corresponding second side shielding portion of the integrated shield that faces the second side of the substrate.
2. The integrated shield electronic component package assembly of claim 1 wherein the side shielding portion extends a side shielding portion distance below the second surface of the substrate and the interconnection structures extend a post-reflow distance below the second surface of the substrate, the side shielding portion distance being less than the post-reflow distance.
3. The integrated shield electronic component package assembly of claim 1 further comprising a shield adhesive coupling the side shielding portion to the first surface of the larger substrate.
4. The integrated shield electronic component package assembly of claim 3 wherein the larger substrate further comprises shield terminals coupled to the first surface, the shield adhesive coupling the side shielding portion to the shield terminals.