Borderless contacts in semiconductor devices
View Patent ↗A method includes depositing a dummy fill material over exposed portions of a substrate and a gate stack disposed on the substrate, removing portions of the dummy fill material to expose portions of the substrate, forming a layer of spacer material over the exposed portions of the substrate, the dummy fill material and the gate stack, removing portions of the layer of spacer material to expose portions of the substrate and the dummy fill material, depositing a dielectric layer over the exposed portions of the spacer material, the substrate, and the gate stack, removing portions of the dielectric layer to expose portions of the spacer material, removing exposed portions of the spacer material to expose portions of the substrate and define at least one cavity in the dielectric layer, and depositing a conductive material in the at least one cavity.
1. A field effect transistor device comprising:
a first gate stack disposed on a substrate;
a first spacer including a first spacer material disposed adjacent to and in contact with the first gate stack;
a second spacer including a second spacer material disposed adjacent to and in contact with the first spacer, the second spacer located at opposing sides of the first gate stack;
a second gate stack disposed on the substrate;
an active region arranged between the first gate stack and the second gate stack;
a third spacer including the first spacer material disposed adjacent to and in contact with the second gate stack;
a dielectric layer disposed over portions of the substrate, the active region, the first gate stack, the first spacer, the second spacer, the second gate stack, and the third spacer, the dielectric layer comprising a different material than the second spacer material; and
a conductive material disposed in a cavity of the dielectric layer, the conductive material contacting the active region, wherein the cavity is defined by removal of vertical portions of the second spacer material not adjacent to the first spacer, such that the conductive material is self-aligned with the active region.
2. The device of claim 1 , wherein the conductive material is disposed over a silicon trench isolation region, and the conductive material contacts a second active region of the substrate.