Fused buss for plating features on a semiconductor die
View Patent ↗A semiconductor structure includes a semiconductor substrate; a semiconductor device formed in and over the substrate; a plurality of interconnect layers over the semiconductor device; an interconnect pad over a top surface of the plurality of interconnect layers, wherein the interconnect pad is coupled to the semiconductor device through the plurality of interconnect layers; a contiguous seal ring surrounding the semiconductor device and extending vertically from the substrate to the top surface of the plurality of interconnect layers; and a fuse coupled between the interconnect pad and the seal ring, wherein the fuse is in a non-conductive state.
1. A semiconductor structure, comprising:
a semiconductor substrate;
a semiconductor device formed in and over the substrate;
a plurality of interconnect layers over the semiconductor device;
an interconnect pad over a top surface of the plurality of interconnect layers, wherein the interconnect pad is coupled to the semiconductor device through the plurality of interconnect layers;
a contiguous seal ring surrounding the semiconductor device and extending vertically from the substrate to the top surface of the plurality of interconnect layers; and
a fuse coupled between the interconnect pad and the seal ring, wherein the fuse is in a non-conductive state.
2. The semiconductor structure of claim 1 wherein the fuse is on the substrate.
3. The semiconductor structure of claim 2 , further comprising a dielectric layer over the fuse and the semiconductor device, wherein the plurality of interconnect layers is over the dielectric layer.
4. The semiconductor structure of claim 2 , wherein the fuse is further characterized as a polysilicon fuse.
5. The semiconductor structure of claim 1 , wherein the fuse is within an interconnect layer of the plurality of interconnect layers.
6. The semiconductor structure of claim 1 , further comprising a plated conductive layer on the interconnect pad.
7. The semiconductor structure of claim 1 , wherein a first terminal of the fuse is connected to the interconnect pad through the plurality of interconnect layers and a second terminal of the fuse is connected to the seal ring through at least one interconnect layer of the plurality of interconnect layers.
8. The semiconductor structure of claim 1 , wherein the contiguous seal ring comprises:
a contiguous edge seal surrounding the semiconductor device; and
a contiguous crack stop surrounding the contiguous edge seal, wherein the fuse is coupled between the interconnect pad and the contiguous edge seal.
9. The semiconductor structure of claim 1 , further comprising:
a plurality of interconnect pads over the top surface of the plurality of interconnect layers; and
a plurality of fuses, each fuse of the plurality of fuses coupled between a corresponding interconnect pad of the plurality of interconnect pads and the seal ring.
10. The semiconductor structure of claim 9 , wherein each fuse of the plurality of fuses is in a non-conductive state.
11. The semiconductor structure of claim 1 , wherein each of the plurality of interconnect layers comprises conductive portions, and wherein the interconnect pad comprises a conductive material that is different from a conductive material of the conductive portions.
12. The semiconductor structure of claim 1 , further comprising a plated conductive layer on an exposed top surface of the contiguous seal ring and on the interconnect pad.
13. A semiconductor structure, comprising:
a semiconductor substrate;
active circuitry in and on the semiconductor substrate;
a plurality of interconnect layers over the active circuitry;
a plurality of interconnect pads over a top surface of the plurality of interconnect layers, wherein each interconnect pad is coupled to the active circuitry through the plurality of interconnect layers;
a contiguous seal ring surrounding the active circuitry and extending vertically from the substrate to the top surface of the plurality of interconnect layers;
a plurality of fuses, wherein each fuse of the plurality of fuses has a first terminal coupled to a corresponding interconnect pad of the plurality of interconnect pads through the plurality of interconnect layers and a second terminal coupled to the seal ring through at least one interconnect layer of the plurality of interconnect layers; and
a plated conductive layer on each interconnect pad of the plurality of interconnect pads.
14. The semiconductor structure of claim 13 , wherein each fuse of the plurality of fuses is further characterized as a polysilicon fuse.
15. The semiconductor structure of claim 13 , wherein each fuse of the plurality of fuses is in a non-conductive state.
16. The semiconductor structure of claim 13 , wherein each fuse of the plurality of fuses is on the semiconductor substrate.
17. The semiconductor structure of claim 13 , wherein at least one fuse of the plurality of fuses is within an interconnect layer of the plurality of interconnect layers.
18. The semiconductor structure of claim 13 , wherein the contiguous seal ring comprises:
a contiguous edge seal surrounding the semiconductor device; and
a contiguous crack stop surrounding the contiguous edge seal, wherein each fuse of the plurality of fuses is coupled between the corresponding interconnect pad and the contiguous edge seal.
19. The semiconductor structure of claim 13 , further comprising a plated conductive layer on an exposed top surface of the contiguous seal ring.
20. A semiconductor structure, comprising:
a semiconductor substrate;
a plurality of interconnect layers over the semiconductor substrate;
in a first die:
first active circuitry in and on the semiconductor substrate, wherein the plurality of interconnect layers is over the first active circuitry;
a first plurality of interconnect pads over a top surface of the plurality of interconnect layers, wherein each interconnect pad of the first plurality of interconnect pads is coupled to the first active circuitry through the plurality of interconnect layers;
a first contiguous seal ring surrounding the first active circuitry and extending vertically from the substrate to the top surface of the plurality of interconnect layers;
a first plurality of fuses, wherein each fuse of the first plurality of fuses has a first terminal coupled to a corresponding interconnect pad of the first plurality of interconnect pads through the plurality of interconnect layers and a second terminal coupled to the first seal ring through at least one interconnect layer of the plurality of interconnect layers; and
a plated conductive layer on each interconnect pad of the first plurality of interconnect pads; and
in a second die, adjacent the first die:
second active circuitry in and on the semiconductor substrate, wherein the plurality of interconnect layers is over the second active circuitry;
a second plurality of interconnect pads over the top surface of the plurality of interconnect layers, wherein each interconnect pad of the second plurality of interconnect pads is coupled to the second active circuitry through the plurality of interconnect layers;
a second contiguous seal ring surrounding the second active circuitry and extending vertically from the substrate to the top surface of the plurality of interconnect layers;
a second plurality of fuses, wherein each fuse of the second plurality of fuses has a first terminal coupled to a corresponding interconnect pad of the second plurality of interconnect pads through the plurality of interconnect layers and a second terminal coupled to the second seal ring through at least one interconnect layer of the plurality of interconnect layers; and
a plated conductive layer on each interconnect pad of the second plurality of interconnect pads; and
a seal ring interconnect which connects the first contiguous seal ring to the second contiguous seal ring through at least one interconnect layer of the plurality of interconnect layers in a scribe street between the first and second die.