Circuit device and method of manufacturing the same
View Patent ↗In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.
1. A circuit device comprising:
a circuit board having a first main surface, a second main surface opposite from the first main surface and a side surface connecting the first and second main surfaces;
a conductive pattern disposed on the first main surface of the circuit board;
a circuit element disposed on the conductive pattern; and
a resin encapsulant covering the circuit board and comprising a first resin encapsulant covering at least the first main surface of the circuit board and part of the side surface of the circuit board and a second resin encapsulant covering at least the second main surface of the circuit board and part of the side surface of the circuit board,
wherein a polymerized region of the first resin encapsulant and the second resin encapsulant is formed beside the side surface of the circuit board, and the polymerized region is located closer to the first main surface than to the second main surface so that a top portion of the polymerized region is located at a position lower than the first main surface of the circuit board.
2. The circuit device according to claim 1 , wherein a particle size of filler contained in the second resin encapsulant is larger than a particle size of filler contained in the first resin encapsulant.
3. The circuit device according to claim 2 , wherein material properties of the filler contained in the second resin encapsulant is different from material properties of the filler contained in the first resin encapsulant, and a thermal conductivity of the filler contained in the second resin encapsulant is larger than a thermal conductivity of the filler contained in the first resin encapsulant.
4. The circuit device according to any one of claims 2 or 3 , wherein the second resin encapsulant is made of a resin obtained by melting and curing a resin sheet formed by pressing a powdered resin and disposed under the second main surface of the circuit board.
5. The circuit device according to claim 2 , wherein a shape of the filler contained in the second resin encapsulant is any one of a crystalline shape and a crushed shape.
6. The circuit device according to claim 3 , wherein a shape of the filler contained in the second resin encapsulant is any one of a crystalline shape and a crushed shape.
7. The circuit device according to claim 2 , wherein the filler contained in the first resin encapsulant is spherical silica, and the filler contained in the second resin encapsulant is alumina.
8. The circuit device according to claim 3 , wherein the filler contained in the first resin encapsulant is spherical silica, and the filler contained in the second resin encapsulant is alumina.
9. The circuit device according to claim 4 , wherein the filler contained in the first resin encapsulant is spherical silica, and the filler contained in the second resin encapsulant is alumina.
10. The circuit device according to claim 5 , wherein the filler contained in the first resin encapsulant is spherical silica, and the filler contained in the second resin encapsulant is alumina.
11. The circuit device according to claim 1 , wherein the circuit board comprises a substrate and an insulating layer disposed on the substrate, and the conductive pattern is disposed on the insulating layer.