Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
View Patent ↗A semiconductor element ( 10 ) is secured to an island ( 7 ), and a plurality of through-holes ( 8 ) are formed in the portion of the island ( 7 ), which surrounds the area to which the semiconductor element ( 10 ) is secured. Further, the electrode pads of the semiconductor element ( 10 ) and leads ( 4 ) are electrically connected by copper wires ( 11 ). In this structure, the cost of materials is reduced by using the copper wires ( 11 ) in comparison with gold wires. Further, a part of a resin package ( 2 ) is embedded in through-holes ( 8 ), so that the island ( 7 ) can be easily supported within the resin package ( 2 ).
1. A semiconductor device comprising:
an island;
a plurality of leads surrounding the island;
a semiconductor element attached to the island with an adhesive;
copper wires which electrically connect electrode pads of the semiconductor element and corresponding leads; and
a resin package which covers the island, the leads, the copper wires, and the semiconductor element,
wherein one of the electrode pads comprises a buffer layer, and a copper wire is ball-bonded to the one of the electrode pads, and
the buffer layer is an electrode layer harder than a metal layer forming the one of the electrode pads and is broken in the one of the electrode pads.
2. The semiconductor device according to claim 1 , wherein a plurality of through-holes are formed in the island around a fixing region of the semiconductor element, and the through-holes are filled with a resin of the resin package.
3. The semiconductor device according to claim 2 , wherein a shape of the through-holes is a circle, an ellipse or a rectangle, and a width of each of the through-holes is a width equal to or larger than an interval between two adjacent leads.
4. A semiconductor device comprising:
an island;
a plurality of leads surrounding the island;
a semiconductor element attached to the island with an adhesive;
copper wires which electrically connect electrode pads of the semiconductor element and corresponding leads; and
a resin package which covers the island, the leads, the copper wires, and the semiconductor element,
wherein one of the electrode pads comprises a buffer layer, and a copper wire is ball-bonded to the one of the electrode pads,
the one of the electrode pads is exposed from an opening portion of a shield layer covering a surface of the semiconductor element, and the buffer layer has a smaller area than an opening of the opening portion and is disposed inside the opening portion, and
a part of a metal layer forming the one of the electrode pads, other than the buffer layer, is disposed between the copper wire and the buffer layer so that the copper wire and the buffer layer are not in direct contact.