Shielding structure for transmission lines
View Patent ↗A shielding structure comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, each comb-like structure comprising a plurality of teeth, the teeth of each comb-like structure extending toward the other comb-like structure; a first plurality of electrically conducting vias extending upward from the first comb-like structure; a second plurality of electrically conducting vias extending upward from the second comb-like structure; first and second planar structures in a second metallization layer above the first metallization layer; a third plurality of electrically conducting vias extending downward from the first planar structure toward the first plurality of electrically conducting vias; and a fourth plurality of electrically conducting vias extending downward from the second planar structure toward the second plurality of electrically conducting vias. The first and second comb-like structures, the first and second planar structures and the first, second, third, and fourth electrically conducting vias all being at substantially the same potential, preferably ground. In one embodiment, one or more signal lines are located in the second metallization layer between the first and second planar structures; and in another embodiment they are located in a third metallization layer between the first and second metallization layers.
1. A shielding structure comprising:
first and second planar structures adjacent to one another in a first metallization layer on an integrated circuit;
third and fourth planar structures adjacent to one another in a second metallization layer on the integrated circuit; and
at least one signal line located in a third metallization layer between the first and second planar structures in the first metallization layer and the third and fourth planar structures in the second metallization layer,
the first, second, third, and fourth planar structures all being at substantially the same potential.
2. The shielding structure of claim 1 wherein the first and second planar structures are first and second arrays of conductive elements defined in the first metallization layer, the conductive elements of the first array being connected together and extending between the conductive elements of the second array, the conductive elements of the second array being connected together.
3. The shielding structure of claim 1 wherein at least one of the planar structures is a comb-like structure.
4. The shielding structure of claim 1 wherein the first and second planar structures are first and second comb-like structures, each comb-like structure comprising a plurality of teeth, the teeth of the first comb-like structure and the teeth of the second comb-like structure extending toward each other.
5. The shielding structure of claim 1 wherein a second signal line is located in a metallization layer between the first and second planar structures in the first metallization layer and the third and fourth planar structures in the second metallization layer.
6. The shielding structure of claim 5 wherein the second signal line is located in a fourth metallization layer between the first and second metallization layers.
7. The shielding structure of claim 1 further comprising a first plurality of electrically conducting vias extending between the first planar structure and the third planar structure and a second plurality of electrically conducting vias extending between the second planar structure and the fourth planar structure.
8. The shielding structure of claim 7 wherein some of the vias of the first plurality of vias extend from the first planar structure toward the third planar structure and some of the vias of the first plurality of vias extend from the third planar structure toward the first planar structure.
9. The shielding structure of claim 7 wherein the first and second pluralities of vias are at the same potential as the first, second, third and fourth planar structures.
10. The shielding structure of claim 7 wherein the first and second pluralities of vias are at the same potential as the first and second arrays and the first and second planar structures.
11. A shielding structure comprising:
first and second arrays of conductive elements defined in a first metallization layer on an integrated circuit, the conductive elements of the first array being connected together and extending between the conductive elements of the second array, the conductive elements of the second array being connected together;
first and second planar structures adjacent to one another in a second metallization layer on the integrated circuit; and
at least one signal line in a third metallization layer between the first and second arrays of conductive elements in the first metallization layer and the first and second planar structures in the second metallization layer;
the first and second arrays and the first and second planar structures all being at substantially the same potential.
12. The shielding structure of claim 11 wherein the first and second planar elements are third and fourth arrays of conductive elements defined in the second metallization layer, the conductive elements of the third array being connected together and extending between the conductive elements of the fourth array, the conductive elements of the fourth array being connected together.
13. The shielding structure of claim 11 wherein at least one of the first and second arrays is a comb-like structure.
14. The shielding structure of claim 11 wherein the first and second arrays are first and second comb-like structures, each comb-like structure comprising a plurality of teeth, the teeth of the first comb-like structure and the teeth of the second comb-like structure extending toward each other.
15. The shielding structure of claim 11 wherein a second signal line is located in a metallization layer between the first and second arrays of conductive elements in the first metallization layer and the first and second planar structures in the second metallization layer.
16. The shielding structure of claim 15 wherein the second signal line is located in a fourth metallization layer between the first and second metallization layers.
17. The shielding structure of claim 11 further comprising a first plurality of electrically conducting vias extending between the first array and the first planar structures and a second plurality of electrically conducting vias extending between the second array and the second planar structure.
18. The shielding structure of claim 17 wherein some of the vias of the first plurality of vias extend from the first array toward the first planar structure and some of the vias of the first plurality of vias extend from the first planar structure toward the first array.
19. A shielding structure comprising:
first and second comb-like structures defined in a first metallization layer on an integrated circuit, each comb-like structure comprising a plurality of teeth, the teeth of each comb-like structure extending toward the other comb-like structure;
first and second planar structures in a second metallization layer on the integrated circuit;
at least one signal line located in a third metallization layer between the first and second comb-like structures in the first metallization layer and the first and second planar structures in the second metallization layer
the first and second comb-like structures and the first and second planar structures all being at substantially the same potential.
20. The shielding structure of claim 19 wherein a second signal line is located in a metallization layer between the first and second comb-like structures in the first metallization layer and the first and second planar structures in the second metallization layer.