Granted Patent B2

US 8,692,134 · App. 13/210,392 · Granted Apr 8, 2014

Abstract

Claims (8)

1. An electrical connection from a first die bond pad that is generally centrally located on a surface of a semiconductor die to a substrate connection pad spaced from a perimeter of the die, the electrical connection, comprising:

a long bond wire having one end attached to the first die bond pad and another end attached to the substrate connection pad; and

a brace for the long bond wire, the brace located proximate to an edge of the die between the first die bond pad and the substrate connection pad, wherein the long bond wire is supported by the brace and the brace prevents the long bond wire from contacting the edge of the die, wherein the brace comprises a second bond wire having first and second ends attached to second and third die bond pads, wherein the second bond wire includes a kink within which the long bond wire rests and the kink prevents the long bond wire from excessive lateral movement during encapsulation.

2. The electrical connection of claim 1 , wherein the second bond wire extends generally perpendicular to the long bond wire.

3. The electrical connection of claim 1 , wherein the second and third die bond pads comprise dummy pads.

4. The electrical connection of claim 1 , wherein the second bond wire is one of a gold wire and a copper wire.

5. The electrical connection of claim 1 , wherein the substrate connection pad comprises a lead finger of a lead frame.

6. The electrical connection of claim 1 , wherein the brace spaces the long bond wire from the die edge by at least two times a diameter of the long bond wire.

Assignments (31)