Plasma processing method
View Patent ↗The present invention provides a dry etching method capable of readily providing rounded top edge portions, called top rounds, at trenches and vias formed by removal of a dummy material. The method of the present invention is a dry etching method for forming trenches or vias by removing a dummy material with its periphery surrounded by an interlayer oxide film, which method includes the steps of etching the dummy material to a predetermined depth, performing isotropic etching after the dummy material etching, and removing remaining part of the dummy material after the isotropic etching.
1. A dry etching method used when forming a metal gate with a gate-last technique, said method comprising:
a round adjustment step of partially removing a dummy gate by etching said dummy gate with its periphery surrounded by an interlayer oxide film to a prespecified depth, and exposing a sidewall of an insulating film disposed between said dummy gate and said interlayer oxide film;
a round forming step of forming a round by isotropic etching a top end part of said insulating film after said round adjustment step; and
a main etching step of removing a remaining part of said dummy gate after said round forming step.
2. A metal gate manufacturing method in a gate-last technique, in which a metal gate is formed by filling a metal film into a trench formed by removing a dummy gate and removing excess of said metal film, said method comprising:
a round adjustment step of removing a part of said dummy gate by plasma etching so that an insulating film arranged on a sidewall of said dummy gate is exposed;
a round forming step of forming a round by isotropic plasma etching at a top end part of said exposed insulating film after said round adjustment step;
a main etching step of removing by plasma etching a remaining part of said dummy gate after said round forming step;
a filling step of filling said metal film into a trench formed in said main etching step; and
a polishing step of removing metal film deposited excessively in said filling step over said trench formed in said main etching step.
3. A plasma processing method of forming a metal gate in a gate-last technique by filling a metal film into a trench formed by removing a dummy gate and removing excess of said metal film, said method comprising:
a round adjustment step of removing a part of said dummy gate by plasma etching so that an insulating film arranged on a sidewall of said dummy gate is exposed;
a round forming step of forming a round by isotropic plasma etching at a top end part of said exposed insulating film after said round adjustment step; and
a main etching step of removing by plasma etching a remaining part of said dummy gate after said round forming step.
4. The plasma processing method according to claim 3 , wherein said isotropic plasma etching in said round forming step is performed with plasma using a mixture gas of fluorine-containing gas and oxygen gas.
5. The plasma processing method according to claim 4 , wherein said isotropic plasma etching in said round forming step is performed without supplying radio-frequency electrical power to a wafer on which a metal gate is formed in a gate-last technique.
6. The plasma processing method according to claim 4 , wherein said mixture gas comprises O 2 and CHF 3 .
7. The plasma processing method according to claim 4 , wherein said mixture gas comprises O 2 and one selected from the group consisting of CF 4 , SF 6 , NF 3 , CH 2 F 2 , CH 3 F, and C 4 F.
8. The plasma processing method according to claim 4 , wherein said isotropic plasma etching in said round forming step is performed by supplying 0 W/cm 2 to 0.042 W/cm 2 radio-frequency electrical power to a wafer on which a metal gate is formed in a gate-last technique.