Gas cluster ion beam etch profile control using beam divergence

1. A method of etching a substrate, comprising:

preparing a mask layer having a pattern formed therein on or above at least a portion of a substrate;

etching a feature pattern into said substrate from said pattern in said mask layer using a gas cluster ion beam (GCIB); and

controlling a sidewall profile of said feature pattern etched into said substrate by adjusting a beam divergence of said GCIB during said etching of said feature pattern,

wherein generating said GCIB includes: selecting a beam acceleration potential, one or more beam focus potentials, and a beam dose to achieve a target for said beam divergence and achieve said sidewall profile of said feature pattern; accelerating said GCIB according to said beam acceleration potential; focusing said GCIB to according to said one or more beam focus potentials; and irradiating said GCIB onto at least a portion of said substrate according to said beam dose.

2. The method of claim 1 , wherein said controlling said sidewall profile further comprises modifying a beam energy, modifying a beam energy distribution, modifying said beam acceleration potential, modifying said one or more beam focus potentials, modifying said beam dose, or adjusting an orientation of said substrate relative to a direction of incidence of said GCIB, or any combination of two or more thereof.

3. The method of claim 1 , further comprising:

directing said GCIB along a GCIB path through an increased pressure region such that at least a portion of said GCIB path traverses said increased pressure region, wherein a pressure for said increased pressure region and a length of said GCIB path are selected to adjust said beam divergence of said GCIB.

4. The method of claim 1 , further comprising:

forming a thin film on at least a portion of said substrate; and

etching said feature pattern into said thin film using said gas cluster ion beam (GCIB).

5. The method of claim 1 , further comprising:

generating said GCIB by alternatingly and sequentially using a first pressurized gas mixture containing an etch gas and a second pressurized gas mixture containing a film forming gas.

6. The method of claim 1 , further comprising:

adjusting a composition of said GCIB during said etching.

7. The method of claim 1 , further comprising:

adjusting a stagnation pressure for generating said GCIB during said etching.

8. The method of claim 1 , wherein said adjusting said beam divergence of said GCIB includes modifying an angular distribution function for said GCIB.

9. The method of claim 8 , wherein said angular distribution function is narrowed by increasing a beam acceleration potential for accelerating said GCIB and said angular distribution function is broadened by decreasing said beam acceleration potential.

10. The method of claim 8 , wherein said angular distribution function is narrowed by narrowing a beam energy distribution for said GCIB and said angular distribution function is broadened by broadening said beam energy distribution.

11. The method of claim 8 , wherein said angular distribution function is narrowed by focusing said GCIB using one or more beam focus potentials and said angular distribution function is broadened by defocusing said GCIB using said one or more beam focus potentials.

12. The method of claim 1 , further comprising:

generating said GCIB using a pressurized gas mixture containing an etch gas and optionally a noble gas.

13. The method of claim 12 , wherein said pressurized gas mixture further contains one or more elements selected from the group consisting of B, C, H, Si, Ge, N, P, As, O, S, F, Cl, and Br.

14. The method of claim 12 , wherein said pressurized gas mixture further contains a film forming gas.

15. The method of claim 14 , wherein said film forming gas comprises a silicon-containing compound, a nitrogen-containing compound, an oxygen-containing compound, or a carbon-containing compound, or any combination of two or more thereof.

16. The method of claim 12 , wherein said etch gas comprises: a compound containing a halogen element; a compound containing F and C; or a compound containing C, H, and F, or any combination of two or more thereof.

17. The method of claim 16 , wherein said etch gas comprises a chlorine-containing compound, a fluorine-containing compound, or a bromine-containing compound.

18. The method of claim 16 , wherein said etch gas comprises a compound containing one or more elements selected from the group consisting of C, F, H, Cl, and Br.