Contact for a non-volatile memory and method therefor
View Patent ↗A semiconductor device is disclosed that comprises a first non-volatile memory cell, a second non-volatile memory cell, an active region between the first and second memory cells, and an electrically conductive contact touching the active region, wherein the contact has a horizontal cross-section that is at least five percent smaller in a first dimension than in a second dimension.
1. A semiconductor device comprising:
a first non-volatile memory cell having a first gate stack;
a second non-volatile memory cell having a second gate stack, wherein the first nonvolatile memory cell and the second non-volatile memory cell share a source/drain region that is between the first gate stack and the second gate stack; and
an electrically conductive contact touching the source/drain region and spaced from the first gate stack and the second gate stack, wherein:
the contact has an oval cross-section touching and contained within the source drain region and having a short dimension and a long dimension;
the short dimension is along a shortest line between the first gate stack and the second gate stack and the long dimension is orthogonal to the shortest line between the first gate stack and the second gate stack;
the first gate stack and the second gate stack are spaced from the contact to reliably avoid touching the contact.
2. The semiconductor device of claim 1 wherein the electrically conductive contact conducts current for programming the first and second non-volatile memory cells.
3. The semiconductor device of claim 1 further comprising:
an upper area of the electrically conductive contact; and
a lower area of the contact, wherein the lower area has a smaller cross-section than the upper area and contacts the source/drain region with the oval cross section.
4. The semiconductor device of claim 3 wherein:
the upper area of the contact has a second oval cross-section.
5. The semiconductor device of claim 3 further comprising:
the upper and lower areas of the electrically conductive contact are selected to be conductive.
6. A semiconductor device comprising:
a first non-volatile memory cell having a first gate stack;
a second non-volatile memory cell having a second gate stack, wherein the first nonvolatile memory cell and the second non-volatile memory cell share a source/drain region that is between the first gate stack and the second gate stack; and
an electrically conductive contact touching the source/drain region, wherein the electrically conductive contact has a horizontal cross-section touching the source/drain region that is at least ten percent smaller in a first dimension than in a second dimension, wherein the first dimension is measured along a line between the first and second gate stacks and is less than a distance between the first and second gate stacks to reliably avoid either the first gate stack or the second gate stack touching the contact.
7. The semiconductor device of claim 6 wherein:
the second dimension of the electrically conductive contact is oriented parallel to sidewalls of the first and second gate stacks.
8. The semiconductor device of claim 6 wherein:
the horizontal cross-section has an oval shape and the first dimension is a width of the oval shape and the second dimension is a length of the oval shape.
9. The semiconductor device of claim 6 further comprising:
a substrate, wherein the first and second non-volatile memory cells, the source/drain region, and the electrically conductive contact are formed on the substrate.
10. The semiconductor device of claim 6 wherein:
the source/drain region has a length aligned parallel to sidewalls of the first and second non-volatile memory cells; and
an upper area of the electrically conductive contact has a length aligned parallel to sidewalls of the first and second memory cells, and the length of the upper area of the electrically conductive contact is greater than the length of an active region.
11. The semiconductor device of claim 6 further comprising:
a metal interconnect including a lower surface touching an upper area of the electrically conductive contact.
12. A method of making a semiconductor device comprising:
forming an array of non-volatile memory cells on a substrate having gate stacks, wherein the nonvolatile memory cells are separated by isolation regions and share source/drain regions between gate stacks; and
forming electrically conductive contacts to the source/drain regions, wherein:
the electrically conductive contacts are contained within the source/drain regions;
the electrically conductive contacts have a first cross-sectional dimension contacting the source/drain regions between the non-volatile memory cells and a second cross-sectional dimension contacting the source/drain regions between the isolation regions;
the electrically conductive contacts are spaced from the gate stacks to reliably avoid touching the gate stacks; and
the first cross-sectional dimension is smaller than the second cross-sectional dimension.
13. The method of claim 12 further comprising:
forming the electrically conductive contacts with an upper area and a lower area, wherein the lower area of the electrically conductive contacts have a smaller cross-section than the upper area.
14. The method of claim 12 wherein:
the electrically conductive contacts have an oval cross-section.
15. The method of claim 14 further comprising:
forming the upper and lower areas of the electrically conductive contacts to be conductive.
16. The method of claim 13 further comprising:
forming metal interconnects including a lower surface in contact with an upper area of the contact.
17. The method of claim 12 wherein:
the first cross-sectional dimension is at least 5 percent smaller than the second cross-sectional dimension.