System-in-a-package based flash memory card
View Patent ↗A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
1. An integrated circuit and one or more external lids for a flash memory card, comprising:
a plurality of integrated circuit components packaged together in a single package, the package having first, second, third and fourth edges and cut to a shape to fit within the one or more external lids and the package having one or more sides cut to a shape to conform to a shape of the one or more external lids and a notch in a corner where the second and third edges come together; and
wherein the one or more external lids encase the integrated circuit package, the one or more external lids having a configuration for a standard SD Card, the notch of the integrated circuit package defining a space between the one or more external lids in which a switch in the flash memory card travels without contacting the second edge or the third edge of the integrated circuit package.
2. An integrated circuit as recited in claim 1 , the single package forming a complete electronic system.
3. An integrated circuit as recited in claim 1 , the single package being a system-in-a-package.
4. An integrated circuit as recited in claim 1 , wherein three sides of the single package are cut to a shape to conform to a shape of the one or more external lids.
5. An integrated circuit as recited in claim 1 , the integrated circuit package occupying less than three-fourths of the area of the one or more external lids.
6. An integrated circuit as recited in claim 1 , the integrated circuit package occupying less than one-half of the area of the one or more external lids.
7. A flash memory card, comprising:
an integrated circuit package including a complete electronic system formed in a single package the package including first, second, third and fourth edges and a notch between the third and fourth edges;
one or more external lids for encasing the integrated circuit package, the integrated circuit package cut to a shape to fit within the one or more external lids and the integrated circuit package having one or more sides cut to a shape to conform to a shape of the one or more external lids, the notch of the integrated circuit package defining a space between the one or more external lids in which a switch in the flash memory card travels without contacting the second edge or the third edge of the integrated circuit package.
8. A flash memory card as recited in claim 7 , the flash memory card being an SD Card.
9. A flash memory card as recited in claim 8 , the integrated circuit package cut to include a chamfer cut to conform to a shape of a chamfer in the one or more external lids.
10. A flash memory card as recited in claim 8 , the integrated circuit package cut to include a notch defining a space in which a switch in the SD Card may operate.
11. A flash memory card as recited in claim 7 , the integrated circuit package being a system-in-a-package.
12. A flash memory card as recited in claim 7 , the integrated circuit package being a multi-chip module.
13. A flash memory card as recited in claim 7 , wherein three sides of the single package are cut to a shape to conform to a shape of the one or more external lids.
14. A flash memory card as recited in claim 7 , the integrated circuit package occupying less than three-fourths of the area of the one or more external lids.
15. A flash memory card as recited in claim 7 , the integrated circuit package occupying less than one-half of the area of the one or more external lids.
16. A flash memory card as recited in claim 7 , wherein the one or more external lids are translucent, the integrated circuit package being visible through the one or more external lids.