IP Library Granted Patent US 8,535,414
Granted Patent B2
US 8,535,414 · App. 13/236,112 · Granted Sep 17, 2013

Recovering of xenon by adsorption process

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Quick Facts
Patent No.
US 8,535,414
App. No.
13/236,112
Granted
Sep 17, 2013
Kind
B2
Abstract

The present invention discloses the improvements to a vacuum swing adsorption (VSA) process used for Xe recovery. By only collecting the recovered gas mixture after the initial evacuation of N 2 from the adsorbent vessel and void space, the recovered Xe is not diluted by N 2 contained in the adsorbent vessel and void space. The concentration of the recovered Xe can by increased (high purity), simultaneously little Xenon is lost. During the initial evacuation of N 2 , the vessel has been evacuated to a pressure less than 1 atmospheric pressure, for example, from 100 to 1 torr.

Claims (30)

1. A process of recovering xenon from a Xe-containing feed gas, comprising the steps of:

providing an adsorption vessel containing an adsorbent having a Xe/N 2 selectivity ratio of less than 65;

feeding the Xe-containing feed gas into the adsorption vessel, wherein the Xe-containing feed gas comprises an initial concentration of nitrogen greater than 50% and an initial concentration of xenon of at least 0.05%;

evacuating the adsorption vessel by reducing pressure from atmospheric pressure to below atmospheric pressure, wherein the evacuating contains two parts: (1) evacuating a first part of gas , and (2) recovering a first xenon-enriched gas when the below atmospheric pressure reaches P 1 ;

purging the adsorption vessel when the below atmospheric pressure reaching P 2 to recover a second xenon-enriched gas, wherein the purging is maintained at the subatmospheric pressure P 2 ; and

combining the first xenon-enriched gas and the second xenon-enriched gas to provide a product gas comprising a final concentration of xenon at least 20 times greater than the initial concentration of xenon;

wherein P 1 is equal to or greater than P 2 .

2. The process of claim 1 , further comprising repressurizing the adsorption vessel after the purging step and repeating the steps of the process at least once.

3. The process of claim 1 , wherein the Xe-containing feed gas comprises an effluent gas of a semiconductor-related manufacturing process.

4. The process of claim 3 , wherein the effluent gas comprises Xe and at least one member selected from the group consisting of HF, F 2 , H 2 O, C 4 F 6 , O 2 , CO 2 , COF 2 , XeF 2 , CF 4 and SiF 4 , is passed through a surge vessel to adsorb at least one of H 2 O, CO 2 , and fluorinated molecules from the effluent gas, and is diluted with N 2 to provide the feed gas for feeding into the adsorption apparatus.

5. The process of claim 1 , wherein the initial concentration of xenon is 0.1% to 5.0%.

6. The process of claim 1 , wherein P 1 is from 100 to 1 torr, and P 2 is from 10 to 0.001 torr.

7. The process of claim 1 , wherein P 1 is from 50 to 5 torr, and P 2 is from 5 to 0.01 torr.

8. The process of claim 1 , wherein P 1 is from 25 to 5 torr, and P 2 is from 3 to 0.5 torr.

9. The process of claim 1 , wherein the adsorbent comprises at least one member selected from the group consisting of an alumina, a zeolite, a silica gel and an activated carbon.

10. The process of claim 1 , wherein the adsorbent consists essentially of particles having a diameter of 0.5 to 3.0 mm.

11. The process of claim 1 , wherein a xenon recovery rate is at least 80%.

12. The process of claim 1 , wherein the process is conducted in a vacuum swing adsorption apparatus containing at least one adsorption vessel.

13. The process of claim 1 , wherein the evacuating the first part of gas is venting the first part of gas.

14. The process of claim 1 , wherein the evacuating the first part of gas is recycling the first part of gas into the feeding step.

15. A process of recovering xenon from a Xe-containing feed gas, comprising the steps of:

providing an adsorption vessel containing an adsorbent having a Xe/N 2 selectivity ratio of less than 65;

feeding the Xe-containing feed gas into the adsorption vessel, wherein the Xe-containing feed gas comprises an initial concentration of nitrogen greater than 50% and an initial concentration of xenon of at least 0.05%;

evacuating the adsorption vessel by reducing pressure from atmospheric pressure to below atmospheric pressure, wherein the evacuating contains two parts: (1) recycling a first part of gas into the feeding step, and (2) recovering a first xenon-enriched gas when the below atmospheric pressure reaches P 1 ;

purging the adsorption vessel when the below atmospheric pressure reaching P 2 to recover a second xenon-enriched gas, wherein the purging is maintained at the subatmospheric pressure P 2 ; and

combining the first xenon-enriched gas and the second xenon-enriched gas to provide a product gas comprising a final concentration of xenon at least 20 times greater than the initial concentration of xenon;

wherein P 1 is equal to or greater than P 2 .

16. The process of claim 15 , further comprising repressurizing the adsorption vessel after the purging step and repeating the steps of the process at least once.

17. The process of claim 15 , wherein the Xe-containing feed gas comprises an effluent gas of a semiconductor-related manufacturing process; and the effluent gas comprises Xe and at least one member selected from the group consisting of HF, F 2 , H 2 O, C 4 F 6 , O 2 , CO 2 , COF 2 , XeF 2 , CF 4 and SiF 4 , is passed through a surge vessel to adsorb at least one of H 2 O, CO 2 , and fluorinated molecules from the effluent gas, and is diluted with N 2 to provide the feed gas for feeding into the adsorption apparatus.

18. The process of claim 15 , wherein the initial concentration of xenon is 0.1% to 5.0%, the adsorbent comprises at least one member selected from the group consisting of an alumina, a zeolite, a silica gel and an activated carbon, P 1 is from 100 to 1 torr, and P 2 is from 10 to 0.001 torr, and the process is conducted in a vacuum swing adsorption apparatus containing at least one adsorption vessel.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Oct 7, 2019
From: CITIBANK, N.A., AS AGENT
To: VERSUM MATERIALS US, LLC
Reel/Frame 050647/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2017
From: AIR PRODUCTS AND CHEMICALS, INC.
To: VERSUM MATERIALS US, LLC
Reel/Frame 041772/0733 →
PATENT SECURITY AGREEMENT Recorded Oct 27, 2016
From: VERSUM MATERIALS US, LLC
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040503/0442 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2011
From: JOHNSON, ANDREW DAVID; PEARCE, RICHARD VINCENT; FARRIS, THOMAS STEPHEN; GOLDEN, TIMOTHY CHRISTOPHER; BOSCO, MATTHEW JOHN; KARWACKI, EUGENE JOSEPH, JR; WINCHESTER, DAVID CHARLES; HUFTON, JEFFREY RAYMOND
To: AIR PRODUCTS AND CHEMICALS, INC.
Reel/Frame 027036/0336 →