IP Library Granted Patent US 9,401,472
Granted Patent B1
US 9,401,472 · App. 13/242,391 · Granted Jul 26, 2016

Programmable impedance elements and devices that include such elements

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Quick Facts
Patent No.
US 9,401,472
App. No.
13/242,391
Granted
Jul 26, 2016
Kind
B1
Abstract

Programmable impedance elements structures, devices and methods are disclosed. Methods can include: forming a first electrode layer within an electrode opening that extends through a cap layer; planarizing to expose a top of the cap layer; cleaning the exposed top surface of the cap layer to remove residual species from previous process steps. Additional methods can include forming at least a base ion conductor layer having an active metal formed therein that may ion conduct within the ion conductor layer; and forming an inhibitor material that mitigates agglomeration of the active metal within the base ion conductor layer as compared to the active metal alone. Programmable impedance elements and/or devices can have switching material and electrodes parallel to both bottoms and sides of a cell opening formed in a cell dielectric. Other embodiments can include an ion conductor layer having an alloy of an active metal, or two ion conductor layers in contact with an active electrode.

Claims (40)

1. A programmable impedance element, comprising:

a first electrode that extends through at least a first dielectric layer;

a switching material and a second electrode formed within a cell opening of a cell insulating layer formed over the first dielectric layer, first portions of the switching material and second electrode being formed parallel to a bottom of the cell opening, and second portions of the switching material and second electrode being formed parallel to a side surface of the cell opening; and

an insulating fill layer formed within the cell opening over at least a portion of the switching material and the second electrode, the insulating fill layer has a top surface substantially coplanar with a top surface of the cell insulating layer.

2. The programmable impedance element of claim 1 , wherein:

the switching material is selected from the group of: a chalcogenide and a transition metal oxide.

3. The programmable impedance element of claim 1 , wherein:

the second portion of the switching material is substantially perpendicular to the top surface of the first dielectric layer.

4. The programmable impedance element of claim 1 , wherein:

the second portion of the second electrode is substantially perpendicular to the top surface of the first dielectric layer.

5. The programmable impedance element of claim 1 , further including:

a conductive fill layer formed within the cell opening over at least a portion of the switching material and the second electrode.

6. The programmable impedance element of claim 5 , wherein:

the conductive fill layer has a top surface substantially coplanar with a top surface of the cell insulating layer.

7. A programmable impedance element, comprising:

a first electrode that extends through at least a first dielectric layer;

a switching material and a second electrode formed within a cell opening of a cell insulating layer formed over the first dielectric layer, first portions of the switching material and second electrode being formed parallel to a bottom of the cell opening, and second portions of the switching material and second electrode being formed parallel to a side surface of the cell opening; wherein

the cell opening is a trench extending in a first direction parallel to first dielectric layer, the trench extending further in the first direction than a second direction perpendicular to the first direction; and

a plurality of first electrodes having top surfaces in a bottom of the trench.

8. The programmable impedance element of claim 7 , wherein:

the switch layer is patterned to form a plurality of switch layer sections within the trench.

9. The programmable impedance element of claim 7 , wherein:

the second electrode is patterned to form a plurality of second electrode sections within the trench.

10. The programmable impedance element of claim 9 , further including:

a second electrode fill material formed in the trench over the second electrode sections.

11. A programmable impedance element, comprising:

a first electrode that extends through at least a first dielectric layer;

a switching material and a second electrode formed within a cell opening of a cell insulating layer formed over the first dielectric layer, first portions of the switching material and second electrode being formed parallel to a bottom of the cell opening, and second portions of the switching material and second electrode being formed parallel to a side surface of the cell opening;

an insulating fill layer formed within the cell opening over at least a portion of the switching material and the second electrode; and

a conductive fill layer formed within the cell opening over at least a portion of the switching material and the second electrode.

12. The programmable impedance element of claim 11 , wherein:

the switching material is selected from the group of: a chalcogenide and a transition metal oxide.

13. The programmable impedance element of claim 11 , wherein:

the second portion of the switching material is substantially perpendicular to the top surface of the first dielectric layer.

14. The programmable impedance element of claim 11 , wherein:

the second portion of the second electrode is substantially perpendicular to the top surface of the first dielectric layer.

15. The programmable impedance element of claim 11 , wherein:

the insulating fill layer has a top surface substantially coplanar with a top surface of the cell insulating layer.

16. The programmable impedance element of claim 11 , wherein:

the conductive fill layer has a top surface substantially coplanar with a top surface of the cell insulating layer.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2023
From: RENESAS DESIGN US INC. (FORMERLY KNOWN AS DIALOG SEMICONDUCTOR US INC. AS SUCCESSOR-IN-INTEREST TO ADESTO TECHNOLOGIES CORPORATION AND ARTEMIS ACQUISITION, LLC)
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 063118/0352 →
RELEASE OF SECURITY INTEREST Recorded Sep 24, 2019
From: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 050480/0836 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2019
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 049125/0970 →
SECURITY INTEREST Recorded May 8, 2018
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
Reel/Frame 046105/0731 →
SECURITY INTEREST Recorded May 22, 2015
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 035754/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2014
From: GOPALAN, CHAKRAVARTHY; GALLO, ANTONIO R.; MA, YI
To: ADESTO TECHNOLOGIES CORPORATION
Reel/Frame 032269/0401 →