Method for packaging an electronic device assembly having a capped device interconnect
View Patent ↗A method for fabricating a thin package that encapsulates a capped MEMS device electrically coupled with one or more encapsulated semiconductor devices is provided. A wafer-level packaging methodology is used in which the capped MEMS device is electrically coupled to a package interconnect, which then allows for electrical coupling to the one or more encapsulated semiconductor devices, as well as external connections.
1. A method for packaging an electronic device assembly, the method comprising:
placing a micro-electromechanical sensor (MEMS) device in a first area for the electronic device assembly;
placing an electronic device in a second area for the electronic device assembly;
placing one or more bond pads in a third area for the electronic device assembly;
electrically coupling an electrical contact of the MEMS device and a bond pad of the one or more bond pads;
forming an encapsulant over and around sides of the MEMS device, the electronic device, the one or more bond pads, and the electrical coupling between the MEMS device and the bond pad;
exposing a first side of the electronic device assembly after said forming the encapsulant, wherein the first side comprises the bond pad and an electrical contact of the electronic device; and
forming, after said exposing, an interconnect structure on the first side of the electronic device assembly, wherein the interconnect structure couples the bond pad to the electrical contact of the electronic device.
2. The method of claim 1 further comprising:
providing an adhesive disposed on a carrier, wherein
said placing the electronic device comprises placing a side of the electronic device comprising the electrical contact of the device down on the adhesive,
said placing the MEMS device comprises placing the MEMS device on the adhesive such that the electrical contact of the MEMS device is accessible for said electrically coupling, and
said placing the one or more bond pads comprises placing the bond pads on the adhesive.
3. The method of claim 2 wherein said electrically coupling the MEMS device and the bond pad comprises forming a wire bond between the electrical contact of the MEMS device and the bond pad.
4. The method of claim 3 , wherein
the adhesive is configured to separate from the carrier at a separation temperature, and
said forming the wire bond between the electrical contact of the MEMS device and the bond pad further comprises performing wire bonding to the bond pad at a temperature below the separation temperature.
5. The method of claim 4 wherein said forming the wire bond between the electrical contact of the MEMS device and the bond pad further comprises performing the wire bonding to the bond pad at a temperature below 90° C.
6. The method of claim 1 wherein the electronic device is a processor configured to process data generated by the MEMS device.
7. The method of claim 1 wherein the electronic device is an application specific integrated circuit configured to process data generated by the MEMS device.
8. The method of claim 1 further comprising:
placing an embedded ground plane in the third area for the electronic device assembly, wherein the embedded ground plane comprises the one or more bond pads.
9. The method of claim 1 further comprising:
placing a lead frame in the third area for the electronic device assembly, wherein the lead frame comprises the one or more bond pads.
10. A method for packaging an electronic device assembly, the method comprising:
forming the electronic device assembly comprising a micro-electromechanical sensor (MEMS) device and an electronic device, wherein the MEMS device and the electronic device are encapsulated in the electronic device assembly; and
electrically coupling the MEMS device to the electronic device using an interconnect structure formed on a first side of the electronic device assembly and a conductive coupling between an electrical contact of the MEMS device to the interconnect structure, wherein
the electronic device is one of a processor or an application specific integrated circuit configured to process data generated by the MEMS device.
11. The method of claim 10 wherein said forming the electronic device assembly comprises:
providing an adhesive layer disposed on a carrier;
placing the MEMS device on the adhesive layer in a first area for the electronic device assembly; and
placing the electronic device on the adhesive layer in a second area for the electronic device assembly.
12. The method of claim 11 , wherein
said forming the electronic device assembly further comprises placing one or more bond pads in an third area for the electronic device assembly; and
said electrically coupling the MEMS device to the electronic device further comprises
electrically coupling an electrical contact of the MEMS device to a bond pad of the one or more bond pads, and
electrically coupling the bond pad to the interconnect structure.
13. The method of claim 12 wherein electrically coupling the electrical contact of the MEMS device to the bond pad further comprises forming a wire bond between the electrical contact of the MEMS device and the bond pad.
14. The method of claim 13 , wherein
the adhesive layer is configured to separate from the carrier at a separation temperature, and
said forming the wire bond between the electrical contact of the MEMS device and the bond pad further comprises performing wire bonding to the bond pad at a temperature below the separation temperature.
15. The method of claim 14 wherein said performing wire bonding to the bond pad further comprises using a reverse bonding technique.
16. The method of claim 13 wherein said forming the wire bond at the electrical contact of the MEMS device comprises using a reverse bonding technique.
17. The method of claim 12 wherein electrically coupling the electrical contact of the MEMS device to the bond pad further comprises depositing a conductive path between the electrical contact of the MEMS device and the bond pad.
18. The method of claim 12 wherein said placing one or more bond pads in a third area for the electronic device assembly further comprises placing an embedded ground plane in the third area for the electronic device assembly, wherein the embedded ground plane comprises the one or more bond pads.
19. The method of claim 12 wherein said placing one or more bond pads in a third area for the electronic device assembly further comprises placing a lead frame in the third area for the electronic device assembly, wherein the lead frame comprises the one or more bond pads.