Method for manufacturing a heterostructure aiming at reducing the tensile stress condition of a donor substrate

1. A method for manufacturing a heterostructure for applications in the field of electronics, photovoltaics, optics or optoelectronics, which comprises:

implanting atomic species in a donor substrate so as to form an embrittlement area therein,

assembling a receiver substrate on the donor substrate, wherein the receiver substrate has a larger thermal expansion coefficient than that of the donor substrate,

detaching a rear portion of the donor substrate along the embrittlement area so as to transfer a thin layer of interest of the donor substrate onto the receiver substrate, and

applying a detachment annealing after assembling but before detaching, in order to facilitate the detaching,

wherein the detachment annealing comprises the simultaneous application of a first temperature to the donor substrate and a second temperature different from the first temperature to the receiver substrate, wherein the first temperature is approximately 300° C., while the second temperature is approximately 80° C.

2. The method according to claim 1 , further comprising forming or depositing an insulator layer on the donor substrate prior to assembling to provide the insulator layer between the donor and receiver substrates.

3. The method according to claim 1 , wherein the assembling of the receiver substrate on the donor substrate is achieved by molecular bonding.

4. The method according to claim 1 , wherein the detachment annealing is accompanied or continued by applying mechanical forces.

5. The method according to claim 1 , wherein the application of the first and second temperatures is accomplished in such a way that the whole of the volume of each substrate has a homogenous temperature.

6. The method according to claim 5 , wherein the first and second temperatures are applied by placing the structure between two heating electrodes.

7. The method according to claim 5 , wherein the application of the first and second temperatures is accomplished by placing each substrate on a support having the corresponding temperature.

8. The method according to claim 7 , wherein the supports are an integral part of a bonding machine.

9. The method according to claim 1 , wherein the donor substrate comprises silicon, and the receiver substrate comprises sapphire.

10. The method according to claim 1 , further comprising applying mechanical forces during or after the detachment annealing to assist in the detaching.

11. The method according to claim 1 , wherein the donor substrate has a diameter of 300 mm and the atomic species to be implanted includes hydrogen and helium.