Stacked semiconductor devices
View Patent ↗A stacked semiconductor device includes a first and a second semiconductor device. A first major surface of each of the first and second devices which includes the active circuitry directly face each other. The first major surface of each of the devices includes a beveled edge on at least one edge, and a probe pad which extends onto the beveled edge. A first opening is located between the beveled edges of the first and second devices on a vertical side of the stacked semiconductor device.
1. A stacked semiconductor device comprising:
a first semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the first semiconductor device having:
active circuitry;
a beveled edge on at least one edge of the first semiconductor device; and
a probe pad which extends onto the beveled edge of the first semiconductor device; and
a second semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the second semiconductor device having:
active circuitry;
a beveled edge on at least one edge of the second semiconductor device; and
a probe pad which extends onto the beveled edge of the second semiconductor device;
wherein:
the first major surface of the first semiconductor device faces the first major surface of the second semiconductor device such that the first major surfaces of the first and second semiconductor devices are between the second major surfaces of the first and second semiconductor devices and wherein the beveled edge of the first semiconductor device faces the beveled edge of the second semiconductor device such that a first opening is formed between the beveled edges of the first and second semiconductor devices on a first vertical side of the stacked semiconductor device.
2. The stacked semiconductor device of claim 1 , wherein the beveled edges of the first opening are capable of aligning a probe tip to the probe pad of the first semiconductor device.
3. The stacked semiconductor device of claim 1 , wherein:
the probe pad of the first semiconductor device is electrically coupled to the active circuitry of the first semiconductor device;
the probe pad of the second semiconductor device is electrically coupled to the active circuitry of the second semiconductor device.
4. The stacked semiconductor device of claim 1 , wherein each of the first and second semiconductor devices comprises a conductive plane, wherein:
the probe pad of the first semiconductor device is electrically coupled to the conductive plane of the first semiconductor device; and
the probe pad of the second semiconductor device is electrically coupled to the conductive plane of the second semiconductor device.
5. The stacked semiconductor device of claim 4 , further comprising:
a heat sink 806 attached to the first vertical side of the stacked semiconductor device, the heat sink having:
a first protruding portion inserted into the first opening between the beveled edges of the first and second semiconductor devices and contacting the probe pad of each of the first and second semiconductor devices.
6. The stacked semiconductor device of claim 1 , further comprising:
a plurality of continuous conductive vias, wherein each continuous conductive via of the plurality of continuous conductive vias extends from the second major surface of the first semiconductor device, through the first semiconductor device to the first major surface of the second semiconductor device.
7. The stacked semiconductor device of claim 6 , wherein at least one continuous conductive via 802 of the plurality of continuous conductive vias is coupled to the active circuitry 103 of each of the first and second semiconductor device.
8. The stacked semiconductor device of claim 6 , wherein:
the active circuitry of the first semiconductor device comprises a fuse which is coupled to the probe pad of the first semiconductor device and a first continuous conductive via of the plurality of continuous conductive vias; and
the active circuitry of the second semiconductor device comprises a fuse which is coupled to the probe pad of the second semiconductor device and a second continuous conductive via of the plurality of conductive vias.
9. The stacked semiconductor device of claim 1 , wherein each of the first and second semiconductor devices is further characterized as a memory device.
10. The stacked semiconductor device of claim 1 , wherein:
the first major surface of the first semiconductor device has a second beveled edge on at a second edge of the first semiconductor device and a second probe pad which extends onto the second beveled edge of the first semiconductor device; and
the first major surface of the second semiconductor device has a second beveled edge on at a second edge of the second semiconductor device and a second probe pad which extends onto the second beveled edge of the second semiconductor device.
11. The stacked semiconductor device of claim 1 , further comprising:
a third semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the third semiconductor device having:
active circuitry;
a beveled edge on at least one edge of the third semiconductor device; and
a probe pad which extends onto the beveled edge of the third semiconductor device;
a fourth semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the fourth semiconductor device having:
active circuitry;
a beveled edge on at least one edge of the fourth semiconductor device; and
a probe pad which extends onto the beveled edge of the fourth semiconductor device;
wherein:
the first major surface of the third semiconductor device faces the first major surface of the fourth semiconductor device such that the first major surfaces of the third and fourth semiconductor devices are between the second major surfaces of the third and fourth semiconductor devices and wherein the beveled edge of the third semiconductor device faces the beveled edge of the fourth semiconductor device such that a second opening is formed between the beveled edges of the third and fourth semiconductor devices on the first vertical side of the stacked semiconductor device; and
the second major surface of the second semiconductor device faces the second major surface of the third semiconductor device, such that the second major surfaces of the second and third semiconductor devices are between the first major surfaces of the second and third semiconductor devices.
12. The stacked semiconductor device of claim 11 , wherein each of third and fourth semiconductor devices comprises a conductive plane, wherein:
the probe pad of the third semiconductor device is electrically coupled to the conductive plane of the third semiconductor device;
the probe pad of the fourth semiconductor device is electrically coupled to the conductive plane of the fourth semiconductor device.
13. The stacked semiconductor device of claim 12 , further comprising:
a heat sink attached to the first vertical side of the stacked semiconductor device, the heat sink having:
a second protruding portion inserted into the second opening between the beveled edges of the third and fourth semiconductor devices and contacting the probe pad of each of the third and fourth semiconductor devices.
14. A stacked semiconductor device comprising:
a first semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the first semiconductor device having active circuitry and having a beveled edge on at least one edge of the first semiconductor device;
a second semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the second semiconductor device having active circuitry and having a beveled edge on at least one edge of the second semiconductor device;
a third semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the third semiconductor device having active circuitry and having a beveled edge on at least one edge of the third semiconductor device;
a fourth semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the fourth semiconductor device having active circuitry and having a beveled edge on at least one edge of the fourth semiconductor device, wherein:
the first major surface of the first semiconductor device faces the first major surface of the second semiconductor device such that the first major surfaces of the first and second semiconductor devices are between the second major surfaces of the first and second semiconductor devices and wherein the beveled edge of the first semiconductor device faces the beveled edge of the second semiconductor device such that a first opening is formed between the beveled edges of the first and second semiconductor devices on a first vertical side of the stacked semiconductor device;
the first major surface of the third semiconductor device faces the first major surface of the fourth semiconductor device such that the first major surfaces of the third and fourth semiconductor devices are between the second major surfaces of the third and fourth semiconductor devices and wherein the beveled edge of the third semiconductor device faces the beveled edge of the fourth semiconductor device such that a second opening is formed between the beveled edges of the third and fourth semiconductor devices on the first vertical side of the stacked semiconductor device; and
the second major surface of the second semiconductor device faces the second major surface of the third semiconductor device, such that the second major surfaces of the second and third semiconductor devices are between the first major surfaces of the second and third semiconductor devices;
a heat sink 806 attached to the first vertical side of the stacked semiconductor device, the heat sink having a first protruding portion inserted into the first opening between the beveled edges of the first and second semiconductor devices and a second protruding portion inserted into the second opening between the beveled edges of the third and fourth semiconductor devices.
15. The stacked semiconductor device of claim 14 , further comprising:
a plurality of continuous conductive vias, wherein each continuous conductive via 802 of the plurality of continuous conductive vias extends from the second major surface of the first semiconductor device, through the first semiconductor device, second semiconductor device, and third semiconductor device.
16. The stacked semiconductor device of claim 15 , wherein at least one continuous conductive via of the plurality of continuous conductive vias are electrically coupled to the active circuitry at the first major surface of each of the first, second, third, and fourth semiconductor device.