Deposition of layer using depositing apparatus with reciprocating susceptor
Atomic layer deposition is performed by reciprocating a susceptor in two directions, subjecting a substrate on the susceptor to two different sequences of processes. By subjecting the susceptor to different sequences of processes, the substrate undergoes different processes that otherwise would have required an additional set of injectors or reactors. The reduced number of injectors or reactors enables a more compact deposition device, and reduces the cost associated with the deposition device.
1. A method of depositing a layer on a substrate, comprising:
causing relative linear movement between an entire substrate and one or more reactors in a first direction, at least one atomic layer deposited on the entire substrate during the relative movement in the first direction by injecting at least a precursor gas and a reactant gas on the entire substrate; and
after causing the relative linear movement between the entire substrate and the one or more reactors in the first direction, causing relative linear movement between the entire substrate and the one or more reactors in a second direction opposite to the first direction;
wherein annealing is performed during the relative linear movement between the one or more reactors in the second direction.
2. The method of claim 1 , further comprising repeating the relative linear movements in the first direction and in the second direction for a predetermined number of times.
3. The method of claim 2 , further comprising:
mounting the entire substrate onto a susceptor before causing the relative linear movement; and
dismounting the substrate from the susceptor after repeating the relative linear movements for the predetermined number of times.
4. The method of claim 1 , further comprising injecting radicals of inert gas onto the entire substrate.
5. The method of claim 4 , further comprising injecting a source precursor onto the entire substrate after injecting the radicals of the inert gas onto the entire substrate.
6. The method of claim 4 , wherein the inert gas comprises Argon gas.
7. The method of claim 1 , wherein the precursor gas comprises Trimethylaluminium, the reactant gas comprises oxygen radicals and the layer comprises Al 2 O 3 .
8. The method of claim 1 , wherein the relative linear movements of the entire substrate are in a plane that contains a deposition surface of the entire substrate.