Semiconductor package with increased I/O density and method of making same
View Patent ↗The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.
1. A semiconductor package, comprising:
a plurality of I/O pads which each have opposed first and second surfaces, and a third surface which extends between the first and second surfaces, the first surface of each of the I/O pads defining a peripheral edge and including a first plated layer formed thereon which protrudes beyond the peripheral edge of the first surface, the third surface of each of the I/O pads being formed such that the first surface is of a first area and the second surface is of a second area which exceeds the first area;
at least one semiconductor die electrically connected to at least some of the I/O pads; and
a package body encapsulating at least portions of the first plated layers and the third surfaces of the I/O pads.
2. The semiconductor package of claim 1 wherein the second surfaces of the I/O pads extend in generally coplanar relation to each other.
3. The semiconductor package of claim 2 wherein the second surfaces of the I/O pads extend in generally coplanar relation to a common exterior surface of the package body.
4. The semiconductor package of claim 2 wherein the first surfaces of the I/O pads extend in generally coplanar relation to each other.
5. The semiconductor package of claim 1 wherein the at least one semiconductor die is electrically connected to at least some of the I/O pads by conductive bumps.
6. The semiconductor package of claim 1 wherein the second surface of each of the I/O pads defines a peripheral edge and includes a second plated layer which is formed thereon and extends to, but not beyond, the peripheral edge thereof.
7. The semiconductor package of claim 6 wherein the second plated layers formed on the I/O pads each protrude outwardly beyond a common exterior surface of the package body.
8. The semiconductor package of claim 7 wherein the second surfaces of the I/O pads extend in generally coplanar relation to the common exterior surface of the package body.
9. The semiconductor package of claim 1 wherein:
the semiconductor die defines a side surface; and
each of the I/O pads is disposed underneath the semiconductor die inboard of the side surface thereof.
10. A semiconductor package, comprising:
a plurality of I/O pads which each have opposed first and second surfaces, and a third surface which extends between the first and second surfaces, the first surface of each of the I/O pads defining a peripheral edge and including a first plated layer formed thereon which protrudes beyond the peripheral edge of the first surface, the third surface of each of the I/O pads being formed such that the first and second surfaces are of differing areas;
at least one semiconductor die attached and electrically connected to at least some of the I/O pads; and
a package body encapsulating at least portions of the first plated layers and the third surfaces of the I/O pads.
11. The semiconductor package of claim 10 wherein the second surfaces of the I/O pads extend in generally coplanar relation to each other.
12. The semiconductor package of claim 11 wherein the second surfaces of the I/O pads extend in generally coplanar relation to a common exterior surface of the package body.
13. The semiconductor package of claim 10 wherein the first surfaces of the I/O pads extend in generally coplanar relation to each other.
14. The semiconductor package of claim 10 wherein the at least one semiconductor die is electrically connected to at least some of the I/O pads by conductive bumps.
15. The semiconductor package of claim 14 wherein the conductive bumps and the semiconductor die are at least partially encapsulated by the package body.
16. The semiconductor package of claim 10 wherein the second surface of each of the I/O pads defines a peripheral edge and includes a second plated layer which is formed thereon and extends to, but not beyond, the peripheral edge thereof.
17. The semiconductor package of claim 16 wherein the second plated layers formed on the I/O pads each protrude outwardly beyond a common exterior surface of the package body.
18. The semiconductor package of claim 17 wherein the second surfaces of the I/O pads extend in generally coplanar relation to the common exterior surface of the package body.
19. The semiconductor package of claim 10 wherein:
the semiconductor die defines a side surface; and
each of the I/O pads is disposed underneath the semiconductor die inboard of the side surface thereof.
20. A semiconductor package, comprising:
a plurality of I/O pads which each have opposed first and second surfaces, and a third surface which extends between the first and second surfaces, the first surface of each of the I/O pads defining a peripheral edge and including a first plated layer formed thereon which protrudes beyond the peripheral edge of the first surface, the third surface of each of the I/O pads being formed such that the first surface is of a first area and the second surface is of a second area which exceeds the first area:
at least one semiconductor die electrically connected to at least some of the I/O pads; and
a package body at least partially encapsulating the I/O pads and the semiconductor die such that at least the second surface of each of the I/O pads is not covered by the package body.