Granted Patent B2

US 8,643,169 · App. 13/292,104 · Granted Feb 4, 2014

Abstract

Claims (12)

1. A semiconductor sensor device, comprising:

a substrate having a first surface with a bond pad on the first surface;

at least one semiconductor sensor die attached to a first side of the substrate;

a bond wire for electrically connecting the sensor die to the bond pad;

a lid mounted to the substrate that covers the sensor die, wherein a cavity is formed between the substrate first surface and the lid;

a mold material layer formed over an outer surface of the lid, wherein the mold material layer includes an opening that is aligned with an opening in the lid, said openings at least partially exposing the sensor die to the external environment; and

a mold bleed control mechanism in the surface of the lid proximate to the hold in the lid.

2. The semiconductor sensor device of claim 1 , wherein the mold bleed control mechanism is a groove.

3. The semiconductor sensor device of claim 1 , further comprising a coating over the sensor die within the cavity.

4. The semiconductor sensor device of claim 3 , wherein the coating is a spray coating.

5. The semiconductor sensor device of claim 3 , wherein the coating is a gel coating.

6. The semiconductor sensor device of claim 1 , further comprising at least two semiconductor dies mounted to the substrate first surface and covered by the lid.

Assignments (32)