A method for forming a field effect transistor device includes patterning an arrangement of fin portions on a substrate, patterning a gate stack portion over portions of the fin portions and the substrate, growing an epitaxial material from the fin portions that electrically connects portions of adjacent fin structures, and removing a portion of the gate stack portion to expose a portion of the substrate.
1. A method for forming a field effect transistor device, the method comprising:
patterning an arrangement of fin portions on a substrate;
patterning a gate stack portion over portions of the fin portions and the substrate;
forming a spacer over the gate stack portion;
forming an oxide layer over the spacer and exposed portions of the fin portions;
growing an epitaxial material from the fin portions that electrically connects portions of adjacent fin structures; and
removing a portion of the gate stack portion to expose a portion of the substrate.
2. The method of claim 1 , wherein the fin portions are arranged substantially in parallel to each other.
3. The method of claim 1 , wherein the gate stack portion is arranged substantially perpendicular to the fin portions.
4. The method of claim 1 , further comprising developing a lithographic masking material over the fin portions, the epitaxial material, portions of the substrate, and portions of the oxide material prior to removing the portion of the gate stack.
5. The method of claim 4 , further comprising removing exposed portions of the oxide material prior to removing the portion of the gate stack.
6. The method of claim 5 , further comprising removing a portion of the spacer to expose the portion of the gate stack prior to removing the portion of the gate stack.
7. The method of claim 1 , wherein each fin portion of the arrangement of fin portions includes a first region partially defined by a first side of the gate portion and a second region partially defined by an opposing second side of the gate portion.
8. The method of claim 7 , wherein the growing the epitaxial material includes growing a first portion of the epitaxial material from the first region and growing a second portion of the epitaxial material from the second region, the first portion of the epitaxial material is separated from the second portion of epitaxial material by the gate stack portion.
9. The method of claim 1 , wherein the gate stack portion prevents contact between a first portion of the epitaxial material and a second portion of the epitaxial material.
10. The method of claim 1 , further comprising patterning a second gate stack portion over portions of the fin portions and the substrate prior to growing the epitaxial material.
11. The method of claim 10 , wherein the second gate stack portion is arranged substantially perpendicular to the fin portions.
12. A method for forming a field effect transistor device, the method comprising:
patterning an arrangement of fin portions on a substrate;
removing a fin portion of the arrangement of fin portions;
patterning a gate stack portion over portions of the remaining fin portions and the substrate;
growing an epitaxial material from the remaining fin portions that electrically connects portions of adjacent fin structures; and
removing a portion of the gate stack portion to expose a portion of the substrate.
13. The method of claim 12 , wherein the removing a portion of the gate stack portion to expose a portion of the substrate includes removing a portion of the gate stack portion disposed over a region of the substrate previously obscured by the removed fin portion.
14. The method of claim 12 , further comprising patterning a second gate stack portion over portions of the remaining fin portions and the substrate prior to growing the epitaxial material, wherein the second gate stack portion is arranged over a region of the substrate previously obscured by the removed fin portion.