IP Library Granted Patent US 8,878,633
Granted Patent B1
US 8,878,633 · App. 13/294,950 · Granted Nov 4, 2014

Vertical differential resonator

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,878,633
App. No.
13/294,950
Granted
Nov 4, 2014
Kind
B1
Abstract

A micromechanical device includes a substrate, a micromechanical structure supported by the substrate and configured for overtone resonant vibration relative to the substrate, and a plurality of electrodes supported by the substrate and spaced from the micromechanical structure by respective gaps. The plurality of electrodes include multiple drive electrodes configured relative to the micromechanical structure to excite the overtone resonant vibration with a differential excitation signal, or multiple sense electrodes configured relative to the micromechanical structure to generate a differential output from the overtone resonant vibration.

Claims (55)

1. A micromechanical device comprising:

a substrate;

a micromechanical structure supported by the substrate and configured for overtone resonant vibration relative to the substrate; and

a plurality of electrodes supported by the substrate and spaced from the micromechanical structure by respective gaps;

wherein the plurality of electrodes comprise:

multiple drive electrodes configured relative to the micromechanical structure to excite the overtone resonant vibration with a differential excitation signal; or

multiple sense electrodes configured relative to the micromechanical structure to generate a differential output from the overtone resonant vibration;

wherein the overtone resonant vibration is at an overtone resonant frequency for the 15th overtone of a fundamental resonant frequency of the micromechanical structure.

2. The micromechanical device of claim 1 , further comprising a plurality of support structures anchored to the substrate, each support structure being coupled to the micromechanical structure at a respective nodal point of a set of nodal points of the micromechanical structure for the overtone resonant vibration.

3. The micromechanical device of claim 2 , wherein the plurality of support structures do not support the micromechanical structure at each nodal point of the set of nodal points.

4. The micromechanical device of claim 2 , wherein the set of nodal points includes supported nodal points and unsupported nodal points supported and not supported by a respective one of the plurality of support structures, respectively, and wherein the supported and unsupported nodal points are disposed in a symmetrical arrangement along the micromechanical structure.

5. The micromechanical device of claim 4 , wherein the symmetrical arrangement disposes each of the supported nodal points adjacent to one of the unsupported nodal points.

6. The micromechanical device of claim 4 , wherein the symmetrical arrangement includes matching locations of the supported and unsupported nodal points on opposing sides of the resonant structure.

7. The micromechanical device of claim 1 , wherein the overtone resonant vibration is a flexural vibration mode.

8. The micromechanical device of claim 1 , wherein the overtone resonant vibration includes vibration in a direction transverse to the substrate.

9. The micromechanical device of claim 1 , wherein the micromechanical structure includes a beam configured for the overtone resonant vibration and spaced from the plurality of electrodes by the respective gaps.

10. The micromechanical device of claim 9 , wherein the beam has a curved shape oriented in parallel with the substrate.

11. The micromechanical device of claim 10 , wherein the curved shape is annular.

12. The micromechanical device of claim 1 , wherein the plurality of electrodes comprise:

the multiple drive electrodes configured relative to the micromechanical structure to excite the overtone resonant vibration with the differential excitation signal; and

the multiple sense electrodes configured relative to the micromechanical structure to generate the differential output from the overtone resonant vibration.

13. The micromechanical device of claim 12 , wherein the multiple drive electrodes and the multiple sense electrodes are biased at different voltages relative to the resonant structure.

14. The micromechanical device of claim 1 , wherein the micromechanical structure comprises a dielectric core.

15. A micromechanical device comprising:

a substrate;

a plurality of support structures anchored to the substrate;

a micromechanical structure supported by the substrate via the plurality of support structures and configured for overtone resonant vibration relative to the substrate, the overtone resonant vibration having a set of nodal points along the micromechanical structure; and

a plurality of electrodes spaced from the micromechanical structure by respective gaps, the plurality of electrodes comprising multiple drive electrodes configured to excite the overtone resonant vibration with a differential excitation signal, and further comprising multiple sense electrodes configured to generate a differential output from the overtone resonant vibration;

wherein each support structure of the plurality of support structures is disposed at a respective nodal point of the set of nodal points,

wherein the micromechanical structure is not supported at each nodal point of the set of nodal points by a respective one of the plurality of support structures, and

wherein the overtone resonant vibration includes vibration in a direction transverse to the substrate.

16. The micromechanical device of claim 15 , wherein the plurality of support structures are disposed in a symmetrical arrangement along the micromechanical structure.

17. The micromechanical device of claim 15 , wherein the overtone resonant vibration is a flexural vibration mode.

18. The micromechanical device of claim 15 , wherein the micromechanical structure includes a beam configured for the overtone resonant vibration and spaced from the plurality of electrodes by the respective gaps.

19. The micromechanical device of claim 15 , wherein the overtone resonant vibration is at an overtone resonant frequency for the 15th overtone of a fundamental resonant frequency of the micromechanical structure.

20. A micromechanical device, comprising:

a substrate;

a plurality of support structures anchored to the substrate;

a micromechanical structure supported by the substrate via the plurality of support structures and configured for overtone resonant vibration relative to the substrate, the overtone resonant vibration having a set of nodal points along the micromechanical structure; and

a plurality of electrodes spaced from the micromechanical structure by respective gaps, the plurality of electrodes comprising multiple drive electrodes configured to excite the overtone resonant vibration with a differential excitation signal, and further comprising multiple sense electrodes configured to generate a differential output from the overtone resonant vibration;

wherein each support structure of the plurality of support structures is disposed at a respective nodal point of the set of nodal points,

wherein the micromechanical structure is not supported at each nodal point of the set of nodal points by a respective one of the plurality of support structures,

wherein the plurality of support structures are disposed in a symmetrical arrangement along the micromechanical structure, and

wherein the symmetrical arrangement divides the set of nodal points into an equal number of supported and unsupported nodal points.

21. The micromechanical device of claim 20 , wherein the overtone resonant vibration includes vibration in a direction transverse to the substrate.

22. A micromechanical device, comprising:

a substrate;

a plurality of support structures anchored to the substrate;

a micromechanical structure supported by the substrate via the plurality of support structures and configured for overtone resonant vibration relative to the substrate, the overtone resonant vibration having a set of nodal points along the micromechanical structure; and

plurality of electrodes spaced from the micromechanical structure by respective gaps, the plurality of electrodes comprising multiple drive electrodes configured to excite the overtone resonant vibration with a differential excitation signal, and further comprising multiple sense electrodes configured to generate a differential output from the overtone resonant vibration;

wherein each support structure of the plurality of support structures is disposed at a respective nodal point of the set of nodal points,

wherein the micromechanical structure is not supported at each nodal point of the set of nodal points by a respective one of the plurality of support structures

wherein the micromechanical structure includes a beam configured for the overtone resonant vibration and spaced from the plurality of electrodes by the respective gaps, and

wherein the beam has a curved shape oriented in parallel with the substrate.

23. The micromechanical device of claim 22 , wherein the curved shape is annular.

Assignments (11)
INTELLECTUAL PROPERTY BUY-IN AGREEMENT/ASSIGNMENT Recorded Apr 4, 2023
From: MICREL LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 063241/0771 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2013
From: DISCERA, INC.
To: MICREL, INCORPORATED
Reel/Frame 031346/0685 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2012
From: HSU, WAN-THAI; HE, GUOHONG; CLARK, JOHN RYAN
To: DISCERA, INC.
Reel/Frame 028152/0547 →