Method of protecting against via failure and structure therefor
View Patent ↗A method is for forming a decoy via and a functional via. The method includes forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer. The method further includes forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of the third interconnect level.
1. A method of forming a decoy via and a functional via, comprising:
forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer, wherein the functional via is susceptible to failure due to vacancies in the metal portion of the first interconnect layer accumulating at the functional via in the absence of the decoy via; and
forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of a third interconnect layer to prevent excessive vacancies from reaching the functional via, wherein the metal portion of the third interconnect layer is not connected to any further circuitry, and the accumulation of vacancies at the decoy via may cause a failure in the decoy via, wherein:
the first interconnect layer is formed by forming a plurality of metal portions in a first dielectric layer, the second interconnect layer is formed by forming a plurality of metal portions in a second dielectric layer, and the third interconnect layer is formed by forming a plurality of metal portions in a third dielectric layer;
the functional via is formed after forming the second interconnect layer;
the portion of the first interconnect layer is a bus having a tab, wherein the functional via contacts the tab;
the decoy via is aligned adjacent to the functional via; and
no space is available for a redundant via directly adjacent to the functional via.
2. The method of claim 1 , wherein no space within the protection region is available in the first interconnect layer for a via.
3. A semiconductor device, comprising:
a first interconnect layer having a plurality of metal portions including a first metal portion;
a second interconnect layer having plurality of metal portions including a second metal portion;
a third interconnect layer having a plurality of metal portions including a third metal portion;
a functional via coupled to the first metal portion and the second metal portion; and
a decoy via in a protection region around the functional via coupled to the first metal portion and the third metal portion to prevent excessive vacancies from reaching the functional via, wherein the metal portion of the third interconnect layer is not connected to any further circuitry;
wherein the functional via is susceptible to failure due to vacancies in the metal portion of the first interconnect layer accumulating at the functional via in the absence of the decoy via, and the accumulation of vacancies at the decoy via may cause a failure in the decoy via;
wherein the first interconnect layer is over the third interconnect layer; and
wherein the first metal portion comprises a bus with a tab, wherein the functional via is coupled to the tab.
4. The semiconductor device of claim 3 , wherein the decoy via is coupled to the tab.
5. The semiconductor device of claim 4 , wherein the functional via extends from a bottom side of the tab and the decoy via is in contact with a top side of the tab.
6. The semiconductor device of claim 5 , wherein the decoy via is aligned adjacent to the functional via.
7. The semiconductor device of claim 6 , wherein no space is available for a via directly adjacent to the functional via.
8. A method, comprising:
forming a first interconnect layer having a plurality of metal portions including a first metal portion;
forming a first interlayer dielectric over the first interconnect layer;
forming a second interconnect layer over the first interlayer dielectric having plurality of metal portions including a second metal portion, wherein during the forming the second interconnect layer forming a functional via through the first interlayer dielectric from the second metal portion to the first metal portion;
forming a second interlayer dielectric layer over the second interconnect layer; and
forming a third interconnect layer over the second interlayer dielectric layer having a plurality of metal portions including a third metal portion, wherein during the forming the third interconnect layer forming a decoy via through the second interlayer dielectric layer from the third metal portion to the second metal portion, wherein the decoy via within a protection region of the functional via and the metal portion of the third interconnect layer is to prevent excessive vacancies from reaching the functional via and is not connected to any further circuitry;
wherein the functional via is susceptible to failure due to vacancies in the metal portion of the first interconnect layer accumulating at the functional via in the absence of the decoy via, and the accumulation of vacancies at the decoy via may cause a failure in the decoy via.
9. The method of claim 8 wherein no space within the protection region is available in the second interconnect layer for a via in addition to the functional via.