Resist pattern forming method and developer
There are provided a method of forming a resist pattern, comprising the steps of forming a resist film containing a specific calixarene derivative on a substrate; forming a pattern latent image by selectively exposing the resist film to a high-energy beam; and developing the latent image by removing parts not exposed to the high-energy beam of the resist film with a developer containing at least one fluorine-containing solvent selected form the group consisting of a fluorine-containing alkyl ether and a fluorine-containing alcohol, and the fluorine-containing solvent as a resist developer.
1. A method of forming a resist pattern, comprising the steps of:
forming on a substrate a resist film comprising at least one calixarene derivative selected from the group consisting of a calixarene derivative 1 represented by the following formula (1) and a calixarene derivative 2 represented by the following formula (2):
wherein R is an alkyl group having 1 to 10 carbon atoms
wherein R is an alkyl group having 1 to 10 carbon atoms and n is an integer of 1 to 3;
forming a latent image by selectively exposing part of the resist film to a high-energy beam; and
developing the latent image by bringing the resist film having the latent image into contact with a developer, which developer comprises a mixture of at least one fluorine-containing solvent and another solvent to remove parts not exposed to the high-energy beam of the resist film, said at least one fluorine-containing solvent being selected from the group consisting of a fluorine-containing alkyl ether and a fluorine-containing alcohol and said another solvent being selected from the group consisting of an alcohol and a glycol ether in an amount of 30 wt % or less based on the total amount of the developer.
2. The method of forming a resist pattern according to claim 1 , wherein the fluorine-containing solvent has a boiling point at atmospheric pressure of 40° C. or higher.
3. The method of forming a resist pattern according to claim 1 or 2 , wherein the substrate obtained by the latent image forming step is subjected to a heating step in which the substrate is heated at a temperature of 80 to 130° C. before the development step.
4. The method according to claim 1 , wherein the irradiation dose of the high-energy beam applied in the latent image forming step is 0.8 mC/cm 2 or less.
5. The method according to claim 1 , said at least one fluorine-containing solvent being present in an amount of 70 wt % or more, and said another solvent being present in an amount of 30 wt % or less, based on the total amount of the developer.