IP Library Granted Patent US 9,182,856
Granted Patent B2
US 9,182,856 · App. 13/330,312 · Granted Nov 10, 2015

Capacitive force sensor

Inventors: John Logan (Danville, CA); Trond Jarle Pedersen (Trondheim, NO); Vemund Kval Bakken (Menlo Park, CA); Kishore Sundara-Rajan (San Jose, CA)
Assignee: Atmel Corporation
G06F3/044G06F3/03545
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Quick Facts
Patent No.
US 9,182,856
App. No.
13/330,312
Granted
Nov 10, 2015
Kind
B2
Abstract

In one embodiment, a method includes detecting movement of a spring structure of a force sensor coupled to a center shaft of an active stylus; measuring a change of capacitance between electrodes of the force sensor; and determining an amount of force applied to the center shaft based on the change of capacitance.

Claims (30)

1. A method comprising:

detecting movement of a spring structure of a force sensor coupled to a center shaft of an active stylus, the spring structure being formed from at least a portion of a printed circuit board (PCB) of the active stylus such that the at least a portion of the PCB forms at least a portion of the spring structure, the spring structure comprising a plurality of cuts in the PCB of the active stylus such that the at least a portion of the PCB from which the spring structure is formed comprises a continuous portion of the PCB;

measuring a change of capacitance between a plurality of electrodes of the force sensor, the electrodes comprising a moving electrode and a stationary electrode, the moving electrode and the stationary electrode formed from the continuous portion of the PCB; and

determining an amount of force applied to the center shaft based on the change of capacitance.

2. The method of claim 1 , wherein the plurality of cuts in the PCB of the active stylus comprises a plurality of substantially serpentine cuts in the PCB of the active stylus, the electrodes comprising the moving electrode and the stationary electrode formed in the substantially serpentine cuts from a metal layer of the PCB.

3. The method of claim 2 , wherein the substantially serpentine cuts are located at an end of the PCB proximate to the center shaft.

4. The method of claim 2 , wherein the substantially serpentine cuts are substantially symmetric with respect to a longitudinal axis of the active stylus.

5. The method of claim 2 , wherein the spring structure comprises a cutout portion in the PCB separating one portion of substantially serpentine cuts from another portion of substantially serpentine cuts.

6. The method of claim 1 , wherein the force sensor comprises an air gap separating the moving electrode from the stationary electrode.

7. The method of claim 1 , wherein a tilt component on the measured force is compensated by averaging a common-mode signal or determining a ratio of signals having a multi-spatial wavelength.

8. One or more computer-readable non-transitory storage media embodying logic configured when executed to:

detect movement of a spring structure of a force sensor coupled to a center shaft of an active stylus, the spring structure being formed from at least a portion of a printed circuit board (PCB) of the active stylus such that the at least a portion of the PCB forms at least a portion of the spring structure, the spring structure comprising a plurality of cuts in the PCB of the active stylus such that the at least a portion of the PCB from which the spring structure is formed comprises a continuous portion of the PCB;

measure a change of capacitance between a plurality of electrodes of the force sensor, the electrodes comprising a moving electrode and a stationary electrode, the moving electrode and the stationary electrode formed from the continuous portion of the PCB; and

determine an amount of force applied to the center shaft based on the change of capacitance.

9. The media of claim 8 , wherein the plurality of cuts in the PCB of the active stylus comprises a plurality of substantially serpentine cuts in PCB of the active stylus, the electrodes comprising the moving electrode and the stationary electrode formed in the substantially serpentine cuts from a metal layer of the PCB.

10. The media of claim 9 , wherein the substantially serpentine cuts are located at an end of the PCB proximate to the center shaft.

11. The media of claim 9 , wherein the substantially serpentine cuts are substantially symmetric with respect to a longitudinal axis of the active stylus.

12. The media of claim 9 , wherein the spring structure comprises a cutout portion in the PCB separating one portion of substantially serpentine cuts from another portion of substantially serpentine cuts.

13. The media of claim 8 , wherein a tilt component on the measured force is compensated by averaging a common-mode signal or determining a ratio of signals having a multi-spatial wavelength.

14. A device comprising:

a force sensor comprising:

a spring structure of a force sensor coupled to a center shaft of an active stylus, the spring structure being formed from at least a portion of a printed circuit board (PCB) of the active stylus such that the at least a portion of the PCB forms at least a portion of the spring structure, the spring structure comprising a plurality of cuts in the PCB of the active stylus such that the at least a portion of the PCB from which the spring structure is formed comprises a continuous portion of the PCB; and

a plurality of electrodes, the electrodes comprising a moving electrode and a stationary electrode, the moving electrode and the stationary electrode formed from the continuous portion of the PCB; and

a controller configured to receive a signal from the force sensor indicative of a change of capacitance between the electrodes and determining an amount of force applied to the center shaft based on the change of capacitance.

15. The device of claim 14 , wherein the plurality of cuts in the PCB of the active stylus comprises a plurality of substantially serpentine cuts in the PCB of the active stylus, the electrodes comprising the moving electrode and the stationary electrode formed in the cuts from a metal layer of the PCB.

16. The device of claim 15 , wherein the substantially serpentine cuts are located at an end of the PCB proximate to the center shaft.

17. The device of claim 15 , wherein the substantially serpentine cuts are substantially symmetric with respect to a longitudinal axis of the active stylus.

18. The device of claim 15 , wherein the spring structure comprises a cutout portion in the PCB separating one portion of substantially serpentine cuts from another portion of substantially serpentine cuts.

19. The device of claim 15 , wherein the force sensor comprises an air gap separating the moving electrode from the stationary electrode.

20. The device of claim 14 , wherein a tilt component on the measured force is compensated by averaging a common-mode signal or determining a ratio of signals having a multi-spatial wavelength.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2018
From: ATMEL CORPORATION
To: WACOM CO., LTD.
Reel/Frame 047640/0227 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Sep 27, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 047158/0958 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Sep 27, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 047159/0792 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2011
From: LOGAN, JOHN; PEDERSEN, TROND JARLE; BAKKEN, VEMUND KVAL; SUNDARA-RAJAN, KISHORE
To: ATMEL CORPORATION
Reel/Frame 027411/0983 →
Continuity (2)
Provisional Application 61553114 · Oct 28, 2011
Related Publication 20130106794A1 · May 2, 2013